Shenzhen Capital Group

Shenzhen Capital Group Co., Ltd is a venture capital firm established by the Shenzhen Government in 1999. The company aims to cultivate national industries, promote economic transformation, and support emerging industries. With a registered capital of 5.42 billion RMB and total assets under management of 338.99 billion RMB, the firm primarily invests in small and medium-sized enterprises (SMEs), innovative high-tech companies, and businesses in various stages of growth and transformation. Its investment focus spans sectors aligned with national policies, including information technology, new media, biopharma, new energy, environmental protection, and high-end equipment manufacturing. By April 2019, Shenzhen Capital Group had built a diverse portfolio of 994 companies, with investments totaling 43.9 billion RMB, and had successfully listed 145 of these companies across 16 global capital markets.

Yu Yao

Senior Investment Manager

Past deals in Semiconductor

Sunwoda Electronic

Post in 2022
Sunwoda Electronic Co., Ltd, founded in 1997 and headquartered in Shenzhen, China, specializes in the research, design, manufacturing, and sale of lithium-ion battery modules and related products. The company produces a diverse range of items, including portable power batteries, automotive battery systems, and power management solutions, along with precision components and integrated energy systems. Sunwoda's products are utilized across various sectors such as mobile phones, laptops, electric vehicles, wearable devices, drones, and energy storage systems. In addition to its manufacturing capabilities, the company offers services in automation, intelligent manufacturing, and laboratory testing. With a commitment to innovation and quality, Sunwoda Electronic has established itself as a key player in the global battery industry.

Morion NanoTech

Series A in 2020
Guangdong Morion Nanotechnology Co., Ltd. researches, develops, and manufactures graphene products. The company’s products include graphene lithium battery electrode materials, graphene composite heat sink materials, graphene display touch screen, graphene transistors, graphene powders, graphene film, graphene reinforced rubber, graphene reinforced fiberglass board, and graphene heat conductive film. It also provides testing services. The company was founded in 2015 and is based in Dongguan, China.

EigenCOMM

Venture Round in 2019
Eigencomm is dedicated to the development and sales of cellular IoT chips.

Aluksen Technology

Series A in 2019
Aluksen Technology is an industry leading semiconductor chip manufacturer specializing in optoelectronic technology. The R&D center is located in Silicon Valley, USA. We focus on the telecom, industrial and consumer electronics markets, and gradually form a marketing and service network with Shenzhen as the operation center and covering the global region. We will continue to innovate around customer needs and strive to provide high customers. Quality products and fast, professional technical support and services.

Chishine Optoelectronics

Series A in 2019
Xi'an Chishine Optoelectronics Technology Co., Ltd. is a high-tech enterprise based in China that focuses on 3D digitization and intelligent hardware development. With over a decade of experience in 3D technology, the company has created advanced 3D imaging and artificial intelligence solutions, including high-precision 3D depth camera technology. These innovations can be integrated into various products such as mobile phones, computers, and robots, finding applications in diverse sectors including home entertainment, medical plastic surgery, military security, cultural industries, maker education, and industrial testing. Chishine has built an extensive 3D face model library, featuring the world's largest high-precision 3D Chinese face dataset. This resource supports the development of cutting-edge 3D artificial intelligence algorithms, enabling advancements in 3D face recognition and gesture interaction, and positioning the company to enter emerging markets such as consumer electronics and high-level security.

Serica Integrated Circuits Technologies

Series A in 2019
Serica Integrated Circuits Technologies is a digital information encryption and decryption chip manufacturer.

XTX Technology

Series B in 2018
XTX Technology Limited is a high-tech semiconductor company based in Shenzhen, China. It specializes in providing a range of reliable and cost-effective memory products, including NAND MCP, NOR MCP, SD NAND, SPI NAND, SPI NOR Flash, and eMMC, which are designed for various embedded applications. These applications encompass mobile phones, tablets, vehicle equipment, security and surveillance systems, point-of-sale terminals, home appliances, machine-to-machine devices, data cards, and set-top boxes, among others. Additionally, XTX Technology offers system-in-package (SIP) assembly services to enhance customer bill of materials cost, improve production efficiency, and bolster software intellectual property security.
Shenzhen Raybow Opto is a high-power semiconductor laser manufacturer located in Shenzhen, China and founded by Research Institute of Tsinghua University in Shenzhen and some of the leading experts in the semiconductor laser industry. Shenzhen Raybow Opto’s core competency includes device design and simulation, a fully functional semiconductor laser chip fabrication line and a packaging and testing facility. The semiconductor laser products offered by Shenzhen Raybow Opto are among the highest power and the most reliable laser diodes available in the market. Shenzhen Raybow Opto also provides the customers with the state-of-the-art testing equipment, services of design consulting, characterization and failure mode analysis.

XTX Technology

Series A in 2018
XTX Technology Limited is a high-tech semiconductor company based in Shenzhen, China. It specializes in providing a range of reliable and cost-effective memory products, including NAND MCP, NOR MCP, SD NAND, SPI NAND, SPI NOR Flash, and eMMC, which are designed for various embedded applications. These applications encompass mobile phones, tablets, vehicle equipment, security and surveillance systems, point-of-sale terminals, home appliances, machine-to-machine devices, data cards, and set-top boxes, among others. Additionally, XTX Technology offers system-in-package (SIP) assembly services to enhance customer bill of materials cost, improve production efficiency, and bolster software intellectual property security.
It is a Chinese lithium battery cover and polymeric positive temperature coefficent (PPTC) supplier.

ASR Microelectronics

Series A in 2017
ASR Microelectronics (Shanghai) Co., Ltd. is a semiconductor manufacturer founded in April 2015 and headquartered in Shanghai, China, specifically in the Zhangjiang Hi-Tech Park. The company specializes in developing chips for mobile intelligent communication terminals, navigation systems, and other consumer electronics. Its product range includes smartphones, modems, and integrated systems on chip (SoC) that support various communication standards, including 2G, 3G, and 4G. ASR boasts a dedicated research and development team located in the United States and South Korea, focusing on platform development and technical support. In 2017, ASR expanded its capabilities by acquiring the Mobile Business Unit from Marvell, positioning itself as a leading baseband provider in China, alongside Hisilicon. The company's significant shareholders include several venture capital firms, highlighting its strong financial backing and commitment to advancing technology in the mobile communications and Internet of Things sectors.

Acetec Semiconductor

Series A in 2013
Zhenjiang Acetic Semiconductor Co., Ltd. (镇江艾科半导体) is a Chinese company providing services that include developing IC testing solutions, IC testing programs, and producing tests of wafers and chips for IC design companies, wafer manufacturers, and packaging and testing plants. The company possesses a testing and manufacture base with an investment of over 300 million Yuan and has established a complete business system of middle- and high-end testing services. It has set up an advanced research and development center in Beijing, and established a talents training institute and a small-scale production base in Wuxi. Zhenjiang Acetic Semiconductor is headquartered in Zhenjiang, China.
Shandong In spur Huaguang Optoelectronics Co., Ltd. (山东浪潮华光光电子股份有限公司) is a Chinese high-tech enterprise specialized in the research, development, and production of compound semiconductor wafers and optoelectronics. With a complete industry chain, Inspur Huaguang Optoelectronics has complete production technologies in the industry, and is capable of producing whole gamut LED wafers, civil LD wafers, and tube cores. It is also capable of dealing with device packaging and LED application products. The main products of the company are epitaxial wafers, chips, LD devices, and LED application products of high brightness semiconductor light-emitting diodes (LED) and civilian laser diodes (LD).

Brigates Microelectronics

Venture Round in 2011
Brigates Microelectronics (KunShan) Co., Ltd (昆山锐芯微电子有限公司) is engaged in the design, development, and sales of integrated circuits. The company’s main product is a CMOS image sensor integrated circuit chip. Founded in February 2008 by a group of leaders from integrated circuit enterprises in North America, the company now has 35 employees. As of today, Brigates Microelectronics has researched and developed four kinds of CMOS sensor chips that include consumer chips of 300000 pixels, 2.0 mega pixels, 3.0 mega pixels, and industrial high-speed image sensor chip monitors. Two image sensors have also been massively produced.

3i Systems

Venture Round in 2010
3i Systems Corporation is an entrepreneurial firm established in November 2006, specializing in large-scale optoelectronic equipment used in the panel display and photovoltaic industries. The company possesses a robust portfolio of independent intellectual property, including numerous scientific and technical invention patents and software copyrights, both domestically and internationally. With a core technical team comprised of experts in semiconductor equipment, 3i Systems emphasizes innovation and expertise in its field. A notable portion of its workforce is highly educated, with 18% holding doctoral degrees or senior professional titles, and 45% possessing master's degrees or equivalent qualifications.

3i Systems

Venture Round in 2009
3i Systems Corporation is an entrepreneurial firm established in November 2006, specializing in large-scale optoelectronic equipment used in the panel display and photovoltaic industries. The company possesses a robust portfolio of independent intellectual property, including numerous scientific and technical invention patents and software copyrights, both domestically and internationally. With a core technical team comprised of experts in semiconductor equipment, 3i Systems emphasizes innovation and expertise in its field. A notable portion of its workforce is highly educated, with 18% holding doctoral degrees or senior professional titles, and 45% possessing master's degrees or equivalent qualifications.

Triductor

Series A in 2008
Triductor Technology, Inc., a semiconductor company, designs and develops mixed-signal integrated circuits, and related hardware and software applications for VDSL2 products. It provides VDSL2 broadband access solutions for consumer, enterprise, and service provider markets. The company also offers CPE Chip, a VDSL2 solution for play, video, and IPTV markets; and CO Digital and CO AFE that enable VDSL2 CO equipments design for triple-play market and other applications. Its products are used in VDSL2 digital subscriber line access multiplexer, customer premises equipment, and multi-dwelling units. Triductor Technology, Inc. was founded in 2005 and is based in Suzhou, China.

SMIC

Series C in 2003
Semiconductor Manufacturing International Corporation (SMIC) is a semiconductor foundry providing integrated circuit (IC) foundry and technology services at 0.35-micron to 40-nanometer. SMIC develops one-stop turnkey services to meet its customers’ needs. In addition to IC manufacturing, SMIC offers a full range of services that includes design services, mask manufacturing, and testing. SMIC provides integrated circuit (IC) foundry and technology services on process nodes from 0.35 micron to 28 nanometer. Headquartered in Shanghai, China, SMIC has an international manufacturing and service base. In China, SMIC has a 300mm wafer fabrication facility (fab) and a 200mm mega-fab in Shanghai; a 300mm mega-fab and a majority-owned 300mm fab for advanced nodes in Beijing; 200mm fabs in Tianjin and Shenzhen; and a majority-owned joint-venture 300mm bumping facility in Jiangyin; additionally, in Italy SMIC has a majority-owned 200mm fab. Headquartered in Shanghai, China, SMIC has a 300mm wafer fabrication facility (fab) and a 200mm mega-fab in Shanghai, a 300mm mega-fab in Beijing, a 200mm fab in Tianjin, and a 200mm fab project under development in Shenzhen. SMIC also has customer service and marketing offices in the U.S., Europe, Japan, and Taiwan, and a representative office in Hong Kong. SMIC competes with Taiwan Semiconductor Manufacturing Company, Ltd., United Microelectronics Corporation, GlobalFoundries, Fujitsu Limited, Samsung Electronics Co., Ltd., and Toshiba Corporation.

SMIC

Series A in 2001
Semiconductor Manufacturing International Corporation (SMIC) is a semiconductor foundry providing integrated circuit (IC) foundry and technology services at 0.35-micron to 40-nanometer. SMIC develops one-stop turnkey services to meet its customers’ needs. In addition to IC manufacturing, SMIC offers a full range of services that includes design services, mask manufacturing, and testing. SMIC provides integrated circuit (IC) foundry and technology services on process nodes from 0.35 micron to 28 nanometer. Headquartered in Shanghai, China, SMIC has an international manufacturing and service base. In China, SMIC has a 300mm wafer fabrication facility (fab) and a 200mm mega-fab in Shanghai; a 300mm mega-fab and a majority-owned 300mm fab for advanced nodes in Beijing; 200mm fabs in Tianjin and Shenzhen; and a majority-owned joint-venture 300mm bumping facility in Jiangyin; additionally, in Italy SMIC has a majority-owned 200mm fab. Headquartered in Shanghai, China, SMIC has a 300mm wafer fabrication facility (fab) and a 200mm mega-fab in Shanghai, a 300mm mega-fab in Beijing, a 200mm fab in Tianjin, and a 200mm fab project under development in Shenzhen. SMIC also has customer service and marketing offices in the U.S., Europe, Japan, and Taiwan, and a representative office in Hong Kong. SMIC competes with Taiwan Semiconductor Manufacturing Company, Ltd., United Microelectronics Corporation, GlobalFoundries, Fujitsu Limited, Samsung Electronics Co., Ltd., and Toshiba Corporation.