SDIC Venture Capital

SDIC Venture Capital Management Co., Ltd., established in 2016 and based in Beijing with an additional office in Shanghai, is a principal investment firm focused on advancing national strategic industries in China. It specializes in sectors such as smart manufacturing, integrated circuits, artificial intelligence, network information security, new materials, consumerism, information technology, environmental protection, new energy, biopharmaceuticals, and healthcare. The firm manages four funds, with total assets under management amounting to RMB 14 billion. SDIC Venture Capital aims to facilitate the marketization and industrialization of scientific and technological achievements while aligning with national innovation strategies. By investing in key research directions and supporting technological innovation, the firm seeks to implement national development strategies and foster collaboration among government, society, and market entities.

Dechun Chen

Vice President

Zhong Guodong

Vice President

Meng Qian

Vice President

Li Ruge

Chief Financial Officer

Du Wenmin

Vice President

Yang Xiaohui

Vice President

Hua Zhang

Chief Financial Officer

Past deals in Semiconductor Equipment

Aluksen Technology

Series B in 2022
Aluksen Technology is an industry leading semiconductor chip manufacturer specializing in optoelectronic technology. The R&D center is located in Silicon Valley, USA. We focus on the telecom, industrial and consumer electronics markets, and gradually form a marketing and service network with Shenzhen as the operation center and covering the global region. We will continue to innovate around customer needs and strive to provide high customers. Quality products and fast, professional technical support and services.

PhotonIC Technologies

Series C in 2019
PhotonIC Technologies is an optoelectronic integrated circuit chips provider. PhotonIC Technologies focus on designing, developing, and commercializing high-speed/low-power optoelectronic integrated chips for data center, 5G transmission, 3D ToF smart sensing and other fields.