NEXX Systems

NEXX Systems, Inc. is a designer and manufacturer of advanced processing equipment focused on wafer-level packaging applications. The company provides a range of systems, including sputter deposition, electro-deposition plating, and plasma cleaning, which are essential for flip chip advanced packaging processes. NEXX's electro-deposition systems facilitate long deposition time processes for applications such as gold and solder wafer bumping, redistribution layers, and various MEMS layers. The technology offered by NEXX Systems supports industries including compound semiconductors, hard disk drive head manufacturing, and inkjet printing. Founded in 2001 and headquartered in Billerica, Massachusetts, the company has established a global presence with representatives and distributors in multiple countries, including the United States, Germany, Italy, France, Switzerland, China, Israel, Korea, Japan, Singapore, and Taiwan.