HuaAn Funds

Tongfu Microelectronics Co., Ltd is a prominent player in the semiconductor industry, specializing in integrated circuit (IC) assembly and testing services. Established in 1997 and headquartered in Nantong, China, the company offers a diverse range of packaging solutions, including wafer-level, flip chip, ball grid array, and various plastic packaging types. Its products cater to numerous applications, including wireless communications, power management, memory, microprocessors, and automotive devices. Tongfu Microelectronics also provides comprehensive support through test platforms and engineering services for analog, mixed-signal, and digital semiconductor devices. The company's focus on meeting the demands of system manufacturers and its alignment with national industrial policies underscore its role in the coordinated development of the semiconductor supply chain. Formerly known as Nantong Fujitsu Microelectronics Co., Ltd, the company rebranded in December 2016 to reflect its growth and commitment to innovation in the semiconductor market.