Teyan Semiconductor
Series B in 2025
Teyan Semiconductor is a provider of semiconductor process and equipment services, specializing in advanced packaging solutions. The company offers a range of production lines, including System in Package (SiP), Fanout, Chiplet, and 3D packaging. Teyan Semiconductor also manufactures precision industrial laser equipment, which includes laser marking, welding, drilling, and cutting machines. These products enable high-end manufacturing in the semiconductor industry, catering to the growing demands for sophisticated packaging technologies and precision manufacturing processes.
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