Khosla Ventures

Khosla Ventures is a California-based venture capital firm founded in 2004 by Vinod Khosla. It provides capital and strategic guidance to startups across stages, focusing on technology-driven companies in areas such as artificial intelligence, climate and sustainability, enterprise software and services, fintech, digital health, medical technology and diagnostics, therapeutics, consumer products, and frontier technologies. The firm backs bold ventures with the potential to disrupt markets and improve lives, supporting companies from early to growth stages and working closely with entrepreneurs to apply science, technology and innovative business models. While primarily investing in North American technology companies, Khosla Ventures pursues opportunities globally and emphasizes experimentation and impact alongside financial returns. The firm also maintains related impact initiatives that support entrepreneurs addressing socio-economic challenges in emerging markets.

Alex Bentley

Partner and Investor

Nessan Bermingham Ph.D

Operating Partner

Ryno Blignaut

Operating Partner

Alice Brooks

Partner

Peter Buckland JD

General Partner and COO

Past deals in CAD

Raspberry AI

Seed Round in 2024
Raspberry AI employs artificial intelligence technology to design styles that are in high demand. The platform offers the convenience of instantly generating technical packs and CADs for any product image, providing a comprehensive solution for product design requirements. It also features automated, high-conversion product descriptions and photography, along with the capability to create new high-fidelity designs from a sketch or reference image.

AREVO

Venture Round in 2021
AREVO, based in Silicon Valley, California, is a technology company specializing in direct digital additive manufacturing of ultra-strong, lightweight composite parts for high-volume end-use applications. The company combines advanced materials, powerful design and build software, and free motion robotics to achieve true three-dimensional construction. This innovative approach allows AREVO to move beyond prototyping, facilitating the design and production of large, mass-manufactured parts and structures. By leveraging the unique properties of composite materials, AREVO provides designers and manufacturers with exceptional flexibility and strength, targeting sectors such as aerospace, defense, consumer electronics, transportation, and consumer goods. With its cutting-edge technology, AREVO is positioned to optimize additive manufacturing services for original equipment manufacturers worldwide.

Avvir

Series A in 2021
Avvir, Inc. is a New York-based company founded in 2017 that specializes in automated construction monitoring services. It offers an enterprise platform designed to streamline construction verification and progress tracking by regularly scanning sites and comparing progress scans to detect defects automatically. The platform integrates with existing systems, enabling seamless workflows from photo capture to construction management. By automating progress tracking, quality control, and as-built documentation, Avvir helps identify potential risks and slowdowns, ultimately reducing costly rework and protecting projects from budget and schedule overruns. This innovative approach transforms Building Information Modeling (BIM) into an official system of record, providing valuable insights to enhance project efficiency and productivity.

AREVO

Series B in 2020
AREVO, based in Silicon Valley, California, is a technology company specializing in direct digital additive manufacturing of ultra-strong, lightweight composite parts for high-volume end-use applications. The company combines advanced materials, powerful design and build software, and free motion robotics to achieve true three-dimensional construction. This innovative approach allows AREVO to move beyond prototyping, facilitating the design and production of large, mass-manufactured parts and structures. By leveraging the unique properties of composite materials, AREVO provides designers and manufacturers with exceptional flexibility and strength, targeting sectors such as aerospace, defense, consumer electronics, transportation, and consumer goods. With its cutting-edge technology, AREVO is positioned to optimize additive manufacturing services for original equipment manufacturers worldwide.

Cover

Series A in 2020
Cover is a technology company that specializes in the design, manufacture, and installation of custom backyard studios and guesthouses. Its mission is to provide access to thoughtfully designed and well-built living spaces for a broader audience. By utilizing proprietary design software and a precision manufacturing system, Cover delivers high-quality, energy-efficient housing alternatives in significantly less time than traditional construction methods. The company focuses on enhancing living environments through an efficient process that includes design, permitting, manufacturing, and installation. Initially launched in Los Angeles, Cover is currently accepting pre-orders from customers around the world.

Avvir

Seed Round in 2019
Avvir, Inc. is a New York-based company founded in 2017 that specializes in automated construction monitoring services. It offers an enterprise platform designed to streamline construction verification and progress tracking by regularly scanning sites and comparing progress scans to detect defects automatically. The platform integrates with existing systems, enabling seamless workflows from photo capture to construction management. By automating progress tracking, quality control, and as-built documentation, Avvir helps identify potential risks and slowdowns, ultimately reducing costly rework and protecting projects from budget and schedule overruns. This innovative approach transforms Building Information Modeling (BIM) into an official system of record, providing valuable insights to enhance project efficiency and productivity.

Avvir

Seed Round in 2019
Avvir, Inc. is a New York-based company founded in 2017 that specializes in automated construction monitoring services. It offers an enterprise platform designed to streamline construction verification and progress tracking by regularly scanning sites and comparing progress scans to detect defects automatically. The platform integrates with existing systems, enabling seamless workflows from photo capture to construction management. By automating progress tracking, quality control, and as-built documentation, Avvir helps identify potential risks and slowdowns, ultimately reducing costly rework and protecting projects from budget and schedule overruns. This innovative approach transforms Building Information Modeling (BIM) into an official system of record, providing valuable insights to enhance project efficiency and productivity.

AREVO

Series B in 2018
AREVO, based in Silicon Valley, California, is a technology company specializing in direct digital additive manufacturing of ultra-strong, lightweight composite parts for high-volume end-use applications. The company combines advanced materials, powerful design and build software, and free motion robotics to achieve true three-dimensional construction. This innovative approach allows AREVO to move beyond prototyping, facilitating the design and production of large, mass-manufactured parts and structures. By leveraging the unique properties of composite materials, AREVO provides designers and manufacturers with exceptional flexibility and strength, targeting sectors such as aerospace, defense, consumer electronics, transportation, and consumer goods. With its cutting-edge technology, AREVO is positioned to optimize additive manufacturing services for original equipment manufacturers worldwide.

Cover

Seed Round in 2017
Cover is a technology company that specializes in the design, manufacture, and installation of custom backyard studios and guesthouses. Its mission is to provide access to thoughtfully designed and well-built living spaces for a broader audience. By utilizing proprietary design software and a precision manufacturing system, Cover delivers high-quality, energy-efficient housing alternatives in significantly less time than traditional construction methods. The company focuses on enhancing living environments through an efficient process that includes design, permitting, manufacturing, and installation. Initially launched in Los Angeles, Cover is currently accepting pre-orders from customers around the world.

AREVO

Series A in 2016
AREVO, based in Silicon Valley, California, is a technology company specializing in direct digital additive manufacturing of ultra-strong, lightweight composite parts for high-volume end-use applications. The company combines advanced materials, powerful design and build software, and free motion robotics to achieve true three-dimensional construction. This innovative approach allows AREVO to move beyond prototyping, facilitating the design and production of large, mass-manufactured parts and structures. By leveraging the unique properties of composite materials, AREVO provides designers and manufacturers with exceptional flexibility and strength, targeting sectors such as aerospace, defense, consumer electronics, transportation, and consumer goods. With its cutting-edge technology, AREVO is positioned to optimize additive manufacturing services for original equipment manufacturers worldwide.

Avametric

Series A in 2016
Avametric, Inc. is a San Francisco-based fashion software company specializing in cloth simulation technology for the apparel industry. Founded in 2012, the company creates digital garments that allow brands to produce 3D renderings of their clothing and accessories on customizable digital body models. This technology enables users to share their body size and shape measurements online, facilitating a virtual fitting room experience. Avametric's platform automates content creation and enhances retail and e-commerce sales tools, thereby improving efficiency in garment design and development. As of October 2018, Avametric operates as a subsidiary of Gerber Technology LLC.

Avametric

Series A in 2015
Avametric, Inc. is a San Francisco-based fashion software company specializing in cloth simulation technology for the apparel industry. Founded in 2012, the company creates digital garments that allow brands to produce 3D renderings of their clothing and accessories on customizable digital body models. This technology enables users to share their body size and shape measurements online, facilitating a virtual fitting room experience. Avametric's platform automates content creation and enhances retail and e-commerce sales tools, thereby improving efficiency in garment design and development. As of October 2018, Avametric operates as a subsidiary of Gerber Technology LLC.

Avametric

Seed Round in 2014
Avametric, Inc. is a San Francisco-based fashion software company specializing in cloth simulation technology for the apparel industry. Founded in 2012, the company creates digital garments that allow brands to produce 3D renderings of their clothing and accessories on customizable digital body models. This technology enables users to share their body size and shape measurements online, facilitating a virtual fitting room experience. Avametric's platform automates content creation and enhances retail and e-commerce sales tools, thereby improving efficiency in garment design and development. As of October 2018, Avametric operates as a subsidiary of Gerber Technology LLC.

eASIC

Private Equity Round in 2013
eASIC Corporation is a fabless semiconductor company based in Santa Clara, California, founded in 1999. The company specializes in manufacturing eASIC platforms that significantly lower the cost of ownership and production time for customized silicon devices. Its product offerings include the Nextreme family of devices, which are designed to reduce development costs and turnaround times compared to standard cell ASICs, while also minimizing power consumption and unit costs. The Nextreme-3 and Nextreme-2 platforms represent the fourth and third generations of these devices, respectively. Additionally, eASIC provides the easicopy ASIC, which offers OEMs a pathway to transition from Nextreme devices to a cell-based design, further enhancing cost efficiency and performance. The eZ-IP alliance program also supports customers by providing access to verified eASIC-ready IP cores, facilitating quicker market entry. eASIC's products are utilized across various applications, including wireless infrastructure and consumer handheld devices, serving a global customer base.

eASIC

Series E in 2010
eASIC Corporation is a fabless semiconductor company based in Santa Clara, California, founded in 1999. The company specializes in manufacturing eASIC platforms that significantly lower the cost of ownership and production time for customized silicon devices. Its product offerings include the Nextreme family of devices, which are designed to reduce development costs and turnaround times compared to standard cell ASICs, while also minimizing power consumption and unit costs. The Nextreme-3 and Nextreme-2 platforms represent the fourth and third generations of these devices, respectively. Additionally, eASIC provides the easicopy ASIC, which offers OEMs a pathway to transition from Nextreme devices to a cell-based design, further enhancing cost efficiency and performance. The eZ-IP alliance program also supports customers by providing access to verified eASIC-ready IP cores, facilitating quicker market entry. eASIC's products are utilized across various applications, including wireless infrastructure and consumer handheld devices, serving a global customer base.

eASIC

Series D in 2008
eASIC Corporation is a fabless semiconductor company based in Santa Clara, California, founded in 1999. The company specializes in manufacturing eASIC platforms that significantly lower the cost of ownership and production time for customized silicon devices. Its product offerings include the Nextreme family of devices, which are designed to reduce development costs and turnaround times compared to standard cell ASICs, while also minimizing power consumption and unit costs. The Nextreme-3 and Nextreme-2 platforms represent the fourth and third generations of these devices, respectively. Additionally, eASIC provides the easicopy ASIC, which offers OEMs a pathway to transition from Nextreme devices to a cell-based design, further enhancing cost efficiency and performance. The eZ-IP alliance program also supports customers by providing access to verified eASIC-ready IP cores, facilitating quicker market entry. eASIC's products are utilized across various applications, including wireless infrastructure and consumer handheld devices, serving a global customer base.

eASIC

Series C in 2005
eASIC Corporation is a fabless semiconductor company based in Santa Clara, California, founded in 1999. The company specializes in manufacturing eASIC platforms that significantly lower the cost of ownership and production time for customized silicon devices. Its product offerings include the Nextreme family of devices, which are designed to reduce development costs and turnaround times compared to standard cell ASICs, while also minimizing power consumption and unit costs. The Nextreme-3 and Nextreme-2 platforms represent the fourth and third generations of these devices, respectively. Additionally, eASIC provides the easicopy ASIC, which offers OEMs a pathway to transition from Nextreme devices to a cell-based design, further enhancing cost efficiency and performance. The eZ-IP alliance program also supports customers by providing access to verified eASIC-ready IP cores, facilitating quicker market entry. eASIC's products are utilized across various applications, including wireless infrastructure and consumer handheld devices, serving a global customer base.

eASIC

Series C in 2005
eASIC Corporation is a fabless semiconductor company based in Santa Clara, California, founded in 1999. The company specializes in manufacturing eASIC platforms that significantly lower the cost of ownership and production time for customized silicon devices. Its product offerings include the Nextreme family of devices, which are designed to reduce development costs and turnaround times compared to standard cell ASICs, while also minimizing power consumption and unit costs. The Nextreme-3 and Nextreme-2 platforms represent the fourth and third generations of these devices, respectively. Additionally, eASIC provides the easicopy ASIC, which offers OEMs a pathway to transition from Nextreme devices to a cell-based design, further enhancing cost efficiency and performance. The eZ-IP alliance program also supports customers by providing access to verified eASIC-ready IP cores, facilitating quicker market entry. eASIC's products are utilized across various applications, including wireless infrastructure and consumer handheld devices, serving a global customer base.
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