European Innovation Council

The European Innovation Council (EIC), established in 2020 and headquartered in Brussels, Belgium, is dedicated to supporting high-potential innovators, entrepreneurs, small enterprises, and researchers. Its primary focus is on fostering early-stage startups that demonstrate significant environmental, social, and governance (ESG) impacts. The EIC collaborates with private investors to co-invest in ventures, particularly within the deep technology sector, aiming to drive innovation and sustainable development across Europe. By providing financial backing and resources, the EIC seeks to enhance the growth potential of promising startups and contribute to a more innovative and competitive European economy.

David Malo Jean

Director

Past deals in Embedded Software

Innatera

Series A in 2024
Innatera is an innovative developer of ultra-low power neuromorphic processors designed to enhance the efficiency of sensor data processing. Established in 2018 as a spin-off from the Delft University of Technology, the company focuses on creating processors that replicate the brain's mechanisms for sensory perception. Utilizing a novel continuous-time analog-mixed signal processing architecture, Innatera's chips can process sensor data up to 100 times faster while consuming up to 500 times less energy compared to traditional processors. This technology enables businesses to access and analyze sensor data more effectively, positioning Innatera as a leader in the field of energy-efficient computing solutions.

Lotus Microsystems

Series A in 2023
Lotus Microsystems offers miniaturized highly integrated point of load power converters. The devices are engineered for portable electronics manufacturers ready for usage whenever tiny power supply units are needed. Our devices offer up to 72% reduction in footprint compared to existing solutions with higher efficiency and reliability. Our plug and play solutions enable our customers to innovate their electronics without worrying about power supply units.

Codasip

Venture Round in 2023
Codasip Ltd. is a processor technology company based in Brno, Czech Republic, founded in 2006. The company specializes in providing intellectual property (IP) and electronic design automation (EDA) tools that facilitate the adoption of application-specific instruction set processors (ASIPs). Codasip's offerings include Codix, RISC-V, and custom processors, allowing system-on-chip developers to customize their products for competitive advantage. Through its design automation tools and an open architecture licensing model, Codasip enables clients to leverage the benefits of the RISC-V instruction set architecture. The company's technology is utilized in billions of devices worldwide, with a diverse customer base that includes notable names such as AMD, Mobileye, and Sigma Designs. Codasip has established strategic partnerships with various organizations, enhancing its capabilities and market reach.

EmbeDL

Venture Round in 2023
EmbeDL specializes in developing optimization software aimed at enhancing artificial intelligence and deep learning models. The company offers a state-of-the-art Deep Learning Model Optimization SDK, which significantly reduces energy consumption by up to 94%, increases execution speed by 16 times, and compresses memory models by a factor of eight. This SDK allows users to create energy-efficient deep learning models that can perform in real-time on cost-effective hardware. By combining proprietary algorithms with cutting-edge research innovations, EmbeDL ensures that model accuracy and precision are maintained throughout the optimization process. The company actively collaborates with leading industry players and academic institutions, fostering a culture of innovation that continually advances the field of embedded intelligence. Through these efforts, EmbeDL aims to streamline and automate the generation of superior deep learning models, making it easier for AI teams to develop competitive solutions in the market.

IDloop

Grant in 2023
IDloop specializes in biometric technology, focusing on contactless fingerprint sensor solutions tailored for both business and government markets. The company’s innovative technology captures secure three-dimensional images of multiple fingers, which significantly reduces false acceptance rates and enhances overall security. By leveraging advanced 3D imaging, artificial intelligence, and embedded technology, IDloop aims to provide efficient and reliable biometric identification, addressing the growing demand for secure access solutions in various sectors.

Ekkono Solutions

Venture Round in 2022
Ekkono Solutions AB, based in Tvååker, Sweden, specializes in machine learning solutions tailored for the Internet of Things (IoT). The company has developed an embedded advanced analytics engine that performs various machine learning techniques directly on connected devices. This technology encompasses the entire workflow, from data input and model training to execution, re-training, and output. Ekkono's solutions are applicable across diverse industries, including energy, telecommunications, automotive, agriculture, healthcare, and housing automation, as well as in consumer IoT applications such as home security systems and smart appliances. By enabling devices to learn their normal operating states, Ekkono's technology facilitates anomaly detection, performance optimization, and predictive maintenance. This edge-based approach allows real-time data processing, minimizing network load by transmitting only relevant information to the cloud. As a result, connected devices become more autonomous and intelligent, enhancing their functionality while reducing dependence on network quality.

EmbeDL

Grant in 2022
EmbeDL specializes in developing optimization software aimed at enhancing artificial intelligence and deep learning models. The company offers a state-of-the-art Deep Learning Model Optimization SDK, which significantly reduces energy consumption by up to 94%, increases execution speed by 16 times, and compresses memory models by a factor of eight. This SDK allows users to create energy-efficient deep learning models that can perform in real-time on cost-effective hardware. By combining proprietary algorithms with cutting-edge research innovations, EmbeDL ensures that model accuracy and precision are maintained throughout the optimization process. The company actively collaborates with leading industry players and academic institutions, fostering a culture of innovation that continually advances the field of embedded intelligence. Through these efforts, EmbeDL aims to streamline and automate the generation of superior deep learning models, making it easier for AI teams to develop competitive solutions in the market.

IDloop

Pre Seed Round in 2022
IDloop specializes in biometric technology, focusing on contactless fingerprint sensor solutions tailored for both business and government markets. The company’s innovative technology captures secure three-dimensional images of multiple fingers, which significantly reduces false acceptance rates and enhances overall security. By leveraging advanced 3D imaging, artificial intelligence, and embedded technology, IDloop aims to provide efficient and reliable biometric identification, addressing the growing demand for secure access solutions in various sectors.

AMSIMCEL

Seed Round in 2022
AMSIMCEL is a deep tech firm based in Bucharest, founded in 2017, that specializes in developing software aimed at enhancing the physical verification process for integrated circuits (ICs). The company focuses on creating technologies that leverage advanced parallel computing and machine simulations to automate circuit verification. By doing so, AMSIMCEL enables clients to expedite their IC design and verification processes, deliver custom intellectual property, and ensure the production of reliable, bug-free silicon. Through its innovative frameworks, AMSIMCEL aims to revolutionize Electronic Design Automation tools and foster advancements within the semiconductor industry.

Ekkono Solutions

Grant in 2022
Ekkono Solutions AB, based in Tvååker, Sweden, specializes in machine learning solutions tailored for the Internet of Things (IoT). The company has developed an embedded advanced analytics engine that performs various machine learning techniques directly on connected devices. This technology encompasses the entire workflow, from data input and model training to execution, re-training, and output. Ekkono's solutions are applicable across diverse industries, including energy, telecommunications, automotive, agriculture, healthcare, and housing automation, as well as in consumer IoT applications such as home security systems and smart appliances. By enabling devices to learn their normal operating states, Ekkono's technology facilitates anomaly detection, performance optimization, and predictive maintenance. This edge-based approach allows real-time data processing, minimizing network load by transmitting only relevant information to the cloud. As a result, connected devices become more autonomous and intelligent, enhancing their functionality while reducing dependence on network quality.

AMSIMCEL

Grant in 2022
AMSIMCEL is a deep tech firm based in Bucharest, founded in 2017, that specializes in developing software aimed at enhancing the physical verification process for integrated circuits (ICs). The company focuses on creating technologies that leverage advanced parallel computing and machine simulations to automate circuit verification. By doing so, AMSIMCEL enables clients to expedite their IC design and verification processes, deliver custom intellectual property, and ensure the production of reliable, bug-free silicon. Through its innovative frameworks, AMSIMCEL aims to revolutionize Electronic Design Automation tools and foster advancements within the semiconductor industry.

SiPearl

Grant in 2022
SiPearl is a French semiconductor company established in 2019, headquartered in Maisons-Laffitte, Île-de-France, with research and development centers located in France, Germany, and Spain. The company specializes in the design of high-performance, low-power microprocessors intended for exascale supercomputers, aligning its product development with the European Union’s technological goals. Its first microprocessor range, Rhea, is set for commercialization in early 2024 and is based on the Arm Neoverse V1 architecture. SiPearl is committed to manufacturing Rhea using advanced processes from TSMC, ensuring state-of-the-art performance. The microprocessors are aimed at a variety of applications, including computing, artificial intelligence, medical research, climate change mitigation, and energy management, serving scientific researchers and major players in the IT, electronics, and automotive sectors.

SiPearl

Series A in 2022
SiPearl is a French semiconductor company established in 2019, headquartered in Maisons-Laffitte, Île-de-France, with research and development centers located in France, Germany, and Spain. The company specializes in the design of high-performance, low-power microprocessors intended for exascale supercomputers, aligning its product development with the European Union’s technological goals. Its first microprocessor range, Rhea, is set for commercialization in early 2024 and is based on the Arm Neoverse V1 architecture. SiPearl is committed to manufacturing Rhea using advanced processes from TSMC, ensuring state-of-the-art performance. The microprocessors are aimed at a variety of applications, including computing, artificial intelligence, medical research, climate change mitigation, and energy management, serving scientific researchers and major players in the IT, electronics, and automotive sectors.

embotech

Grant in 2022
embotech AG specializes in developing decision-making software solutions for autonomous systems. Founded in 2013 as a spin-off from the Automatic Control Laboratory at ETH Zurich, the company provides FORCES Pro, a numerical optimization software that enables the design of complex control systems. This software is utilized in various applications, including the control of wind turbines, planning the collision-free motion of autonomous drones, and the development of advanced driver assistance systems. Additionally, it supports precision landing of spacecraft on other planets and the recovery of reusable rockets. Embotech's solutions cater to sectors such as automotive, energy, and robotics, aiming to enhance safety, productivity, and energy efficiency in automated decision-making processes. The company is headquartered in Zurich, Switzerland.

Codasip

Grant in 2022
Codasip Ltd. is a processor technology company based in Brno, Czech Republic, founded in 2006. The company specializes in providing intellectual property (IP) and electronic design automation (EDA) tools that facilitate the adoption of application-specific instruction set processors (ASIPs). Codasip's offerings include Codix, RISC-V, and custom processors, allowing system-on-chip developers to customize their products for competitive advantage. Through its design automation tools and an open architecture licensing model, Codasip enables clients to leverage the benefits of the RISC-V instruction set architecture. The company's technology is utilized in billions of devices worldwide, with a diverse customer base that includes notable names such as AMD, Mobileye, and Sigma Designs. Codasip has established strategic partnerships with various organizations, enhancing its capabilities and market reach.

Codasip

Venture Round in 2022
Codasip Ltd. is a processor technology company based in Brno, Czech Republic, founded in 2006. The company specializes in providing intellectual property (IP) and electronic design automation (EDA) tools that facilitate the adoption of application-specific instruction set processors (ASIPs). Codasip's offerings include Codix, RISC-V, and custom processors, allowing system-on-chip developers to customize their products for competitive advantage. Through its design automation tools and an open architecture licensing model, Codasip enables clients to leverage the benefits of the RISC-V instruction set architecture. The company's technology is utilized in billions of devices worldwide, with a diverse customer base that includes notable names such as AMD, Mobileye, and Sigma Designs. Codasip has established strategic partnerships with various organizations, enhancing its capabilities and market reach.

SiPearl

Venture Round in 2021
SiPearl is a French semiconductor company established in 2019, headquartered in Maisons-Laffitte, Île-de-France, with research and development centers located in France, Germany, and Spain. The company specializes in the design of high-performance, low-power microprocessors intended for exascale supercomputers, aligning its product development with the European Union’s technological goals. Its first microprocessor range, Rhea, is set for commercialization in early 2024 and is based on the Arm Neoverse V1 architecture. SiPearl is committed to manufacturing Rhea using advanced processes from TSMC, ensuring state-of-the-art performance. The microprocessors are aimed at a variety of applications, including computing, artificial intelligence, medical research, climate change mitigation, and energy management, serving scientific researchers and major players in the IT, electronics, and automotive sectors.

Lotus Microsystems

Grant in 2021
Lotus Microsystems offers miniaturized highly integrated point of load power converters. The devices are engineered for portable electronics manufacturers ready for usage whenever tiny power supply units are needed. Our devices offer up to 72% reduction in footprint compared to existing solutions with higher efficiency and reliability. Our plug and play solutions enable our customers to innovate their electronics without worrying about power supply units.

SiPearl

Grant in 2021
SiPearl is a French semiconductor company established in 2019, headquartered in Maisons-Laffitte, Île-de-France, with research and development centers located in France, Germany, and Spain. The company specializes in the design of high-performance, low-power microprocessors intended for exascale supercomputers, aligning its product development with the European Union’s technological goals. Its first microprocessor range, Rhea, is set for commercialization in early 2024 and is based on the Arm Neoverse V1 architecture. SiPearl is committed to manufacturing Rhea using advanced processes from TSMC, ensuring state-of-the-art performance. The microprocessors are aimed at a variety of applications, including computing, artificial intelligence, medical research, climate change mitigation, and energy management, serving scientific researchers and major players in the IT, electronics, and automotive sectors.

Nestwave

Venture Round in 2021
Nestwave SAS, established in 2014 and based in Paris, France, specializes in developing geolocation systems tailored for the Internet of Things (IoT) market. The company provides innovative geolocation solutions that leverage patented hybrid-signal technology to enhance localization accuracy, particularly in challenging indoor and dense urban settings. Nestwave's platform integrates a digital signal processing (DSP) software solution, enabling IoT modem and DSP vendors to incorporate accurate geolocation capabilities into their products. This approach not only improves reliability and accuracy but also minimizes power consumption and reduces the overall footprint of the solution compared to traditional methods.

Nestwave

Grant in 2020
Nestwave SAS, established in 2014 and based in Paris, France, specializes in developing geolocation systems tailored for the Internet of Things (IoT) market. The company provides innovative geolocation solutions that leverage patented hybrid-signal technology to enhance localization accuracy, particularly in challenging indoor and dense urban settings. Nestwave's platform integrates a digital signal processing (DSP) software solution, enabling IoT modem and DSP vendors to incorporate accurate geolocation capabilities into their products. This approach not only improves reliability and accuracy but also minimizes power consumption and reduces the overall footprint of the solution compared to traditional methods.
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