Legend Capital, established in 2001, is a Beijing-based venture capital firm and subsidiary of Legend Holdings Ltd. It manages multiple funds totaling up to US$700 million, focusing on early-stage IT companies and mid-market growth stage companies in China. Its investment sectors include network applications and services, outsourcing, professional services, IC design, key components, consumer goods, clean technology, healthcare, and modern services. Legend Capital actively supports its portfolio companies, providing business resources and tailored services to facilitate growth and enhance returns. Notable portfolio companies include Joyo.com (acquired by Amazon.com) and Spreadtrum Communications (Nasdaq: SPRD).
10/F, Tower A, Raycom Info.Tech Center, No.2 Ke Xue Yuan Nanlu, Zhong Guan Cun, Haidian District, Beijing 100190, China
Daqing Cai
Managing Director
Hao Chen
Managing Director and Head of Investment
Raymond CHEN
Co-Chief Investment Officer
Rui Chen
Managing Director
Frank Hong
Managing Director
Henry Ji
Executive Director
Yi Kang
Director
Richard Li
President
Jiaqing Li
Managing Director
Joon Sung Park
Executive Director
FAN Qihui
Executive Director
Jenking Shao
Managing Director and Partner
Zhenxing Shao
Partner / Managing Director
Jeff Wang
Managing Director
Junfeng Wang
Managing Director
Nengguang Wang
Managing Director and CFO
Piau-Voon Wang
COO
Tony WANG
VP
Ge Xinyu
Managing Director
Quan Zhou
Managing Director, Partner
Hank Zhou
Executive Director
Hongbin Zhou
Managing Director
Linan Zhu
Chairman
William Wen
Executive Director
Past deals in Semiconductor
TBSTest
Series D in 2024
TBSTest Technology is a developer and manufacturer of automatic test equipment for integrated circuits, specializing in ultra-large-scale integrated circuit testing. Founded in 2017 and headquartered in Beijing, China, with additional offices in Xi’an and Shanghai, as well as Suwon, South Korea, the company provides a comprehensive range of products, including test boards, software solutions, and memory systems. TBSTest Technology also offers pre-sales and after-sales support for its equipment, accessories, and software systems, along with application development projects. The company serves a diverse clientele, including clients engaged in integrated circuit design and production, as well as scientific research institutions and educational establishments.
Infinigence
Series A in 2024
Infinigence is dedicated to providing AGI computing power solutions based on its large model energy efficiency optimization tools, with the goal of resolving the challenge of efficient and unified deployment of large model algorithms to large computing power chips.
Leadrive
Series D in 2023
LEADRIVE is a technology company specializing in the research, development, production, and sales of drive solutions for new energy vehicles, as well as high-performance power semiconductor modules. The company designs and manufactures advanced motor controllers and proprietary power modules that have been adopted by over ten leading automotive manufacturers and Tier-1 suppliers for mass production. LEADRIVE is also engaged in enhancing the localization of power semiconductor modules, with ongoing certification processes for silicon carbide modules and electronic controls. Additionally, the company invests in innovative energy solutions, including wind, solar, and energy storage systems. In collaboration with Rohm Semiconductor from Japan, LEADRIVE has established a joint laboratory to develop various silicon carbide modules, focusing on improving efficiency through comprehensive simulation, testing, and development processes that span from device-level to vehicle-level applications.
Litecore
Venture Round in 2023
Litecore is a manufacturer of optoelectronic devices and processors for broadband, large data centers, and information security.
SpacemiT
Series A in 2023
SpacemiT is a computing chip company that specializes in the development and manufacture of next-generation RISC-V architecture chips. The company aims to create natively integrated cloud-edge-device architectures, delivering powerful computing solutions that combine both hardware and software optimization. By focusing on high-performance CPUs, SpacemiT seeks to establish itself as a significant player in the global computing landscape, providing enhanced cloud computation capabilities and high-performance computing resources to its users. Through its innovative approach, the company is positioned to play a crucial role in meeting the growing demands for computing power in the digital age.
Using.AI
Seed Round in 2023
Using.AI is an AI application service provider focused on enhancing the advanced manufacturing industry through innovative technology. The company specializes in machine vision, robotics learning, and machine learning, developing self-learning solutions that optimize manufacturing processes. Its products are designed to benefit sectors such as OLED, optics components, and semiconductor devices, contributing to significant advancements in efficiency and performance within these markets.
SJ Semi
Series C in 2023
SJ Semi is a MEOL foundry focused on front-end wafer manufacturing and quality systems. The company specializes in bumping, Cu pillar, RDL, and testing services for 12" wafers while investing in R&D for fan-out, TSV, interposer, and 3D technologies. With over a decade of experience, SJ Semi aims to support advancements in the semiconductor market.
CMind-SEMI
Series A in 2023
CMind is committed to becoming the new global leader in smartphone communication chips by concentrating on 4G and 5G advanced wireless communication chips and complete solutions.
PolarisIC
Seed Round in 2022
Polarisic specializes in the development of advanced measurement and imaging chip products, primarily utilizing single-photon avalanche diode (SPAD) technology. The company offers two main product lines: direct photon time-of-flight (dToF) measurement chips and low-light imaging chips. The dToF chips are designed for applications such as Unmanned Aerial Vehicle (UAV) height determination, obstacle avoidance, navigation for automated guided vehicles (AGVs), and smart perception in the Internet of Things (IoT). The low-light imaging chips feature high sensitivity and pixel digitization capabilities, making them suitable for night vision systems, security monitoring, smart industrial measurement, and enhanced smartphone photography. Polarisic is recognized for its technological innovations in dToF detection, high-speed digital processing, detection algorithm fusion, and system integration.
Sifli Technologies
Series A in 2022
Sifli Technologies specializes in the design and development of chips for embedded artificial intelligence and Internet of Things (IoT) applications. The company creates platforms that facilitate data collection and processing for IoT sensors, as well as inferential processing for edge artificial intelligence. Its products support a range of applications, including smart wearables, medical and health equipment, home automation, intelligent terminals, industrial instruments, and intelligent buildings. By focusing on these areas, Sifli Technologies aims to enhance the functionality and efficiency of connected devices across various industries.
Leadrive
Series C in 2022
LEADRIVE is a technology company specializing in the research, development, production, and sales of drive solutions for new energy vehicles, as well as high-performance power semiconductor modules. The company designs and manufactures advanced motor controllers and proprietary power modules that have been adopted by over ten leading automotive manufacturers and Tier-1 suppliers for mass production. LEADRIVE is also engaged in enhancing the localization of power semiconductor modules, with ongoing certification processes for silicon carbide modules and electronic controls. Additionally, the company invests in innovative energy solutions, including wind, solar, and energy storage systems. In collaboration with Rohm Semiconductor from Japan, LEADRIVE has established a joint laboratory to develop various silicon carbide modules, focusing on improving efficiency through comprehensive simulation, testing, and development processes that span from device-level to vehicle-level applications.
Nuclei System Technology
Venture Round in 2022
Nuclei System Technology is a pioneer in China for the commercialization of RISC-V processor licensing. The company focuses on the development of high-performance and low-power processors, along with their associated system-on-chip (SoC) platforms, aimed at meeting the increasing demand for embedded system applications globally. Nuclei's semiconductor technology is tailored for smart electronics, telecommunications, and computer processing cores. It specializes in creating configurable 32/64-bit RISC-V processors designed for artificial intelligence of things (AIoT) applications, thus delivering innovative solutions to its customers.
CMind-SEMI
Series A in 2022
CMind is committed to becoming the new global leader in smartphone communication chips by concentrating on 4G and 5G advanced wireless communication chips and complete solutions.
TBSTest
Venture Round in 2022
TBSTest Technology is a developer and manufacturer of automatic test equipment for integrated circuits, specializing in ultra-large-scale integrated circuit testing. Founded in 2017 and headquartered in Beijing, China, with additional offices in Xi’an and Shanghai, as well as Suwon, South Korea, the company provides a comprehensive range of products, including test boards, software solutions, and memory systems. TBSTest Technology also offers pre-sales and after-sales support for its equipment, accessories, and software systems, along with application development projects. The company serves a diverse clientele, including clients engaged in integrated circuit design and production, as well as scientific research institutions and educational establishments.
Senscomm Semiconductor
Series A in 2022
Senscomm Semiconductor Co., Ltd. is a fabless semiconductor company founded in 2018 and based in Suzhou, China. The company focuses on developing and providing innovative semiconductor solutions for various applications, including augmented reality (AR), virtual reality (VR), the Internet of Things (IoT), and electric vehicles (EV). Since its inception, Senscomm has successfully launched over 20 products to meet the growing global demand in these high-tech sectors.
Qingwei Intelligent Technology
Series B in 2022
Qingwei Intelligent Technologies creates artificial intelligence chips that may be reconfigured to improve energy efficiency. The company's chips are designed with low power consumption, intelligent speech and visual features in mind, providing customers with a better consumer electronics experience and application.
ESWIN Computing
Series C in 2021
ESWIN Computing specializes in the research and development of RISC-V computing architecture, focusing on the design and testing of integrated circuits for Internet of Things (IoT) applications. The company develops chips used in display devices and wearable technology, providing comprehensive solutions in areas such as artificial intelligence, human-computer interaction, and the Internet of Vehicles. By combining innovative design with advanced materials, ESWIN Computing aims to enhance user experiences across various digital platforms.
Litecore
Venture Round in 2021
Litecore is a manufacturer of optoelectronic devices and processors for broadband, large data centers, and information security.
Qutronix
Seed Round in 2021
Qutronix is a company focused on the development of optical quantum chips and quantum computing technologies. It aims to advance the industrialization of quantum information and intelligent technology by utilizing photonic chips. The company offers quantum secure communication services and comprehensive solutions for remote confidential control in the Internet of Things sector. Its cutting-edge three-dimensional integrated optical quantum chip, created through femtosecond laser direct writing technology, serves as a promising resource for quantum computing and processing. Additionally, Qutronix provides a platform for research into analog quantum computers, assisting clients in exploring advanced applications such as power factor optimization and quantum search algorithms, thereby fostering connections between theoretical algorithms and practical engineering solutions.
Kunlun
Venture Round in 2021
Kunlun is an artificial intelligence chip designer and manufacturer.
Kunlun Core
Private Equity Round in 2021
Kunlun Chip is a chip business company under Baidu.
Leadrive
Series B in 2020
LEADRIVE is a technology company specializing in the research, development, production, and sales of drive solutions for new energy vehicles, as well as high-performance power semiconductor modules. The company designs and manufactures advanced motor controllers and proprietary power modules that have been adopted by over ten leading automotive manufacturers and Tier-1 suppliers for mass production. LEADRIVE is also engaged in enhancing the localization of power semiconductor modules, with ongoing certification processes for silicon carbide modules and electronic controls. Additionally, the company invests in innovative energy solutions, including wind, solar, and energy storage systems. In collaboration with Rohm Semiconductor from Japan, LEADRIVE has established a joint laboratory to develop various silicon carbide modules, focusing on improving efficiency through comprehensive simulation, testing, and development processes that span from device-level to vehicle-level applications.
Eswin
Series B in 2020
Eswin specializes in integrated circuit (IC) application solutions across various sectors, including mobile devices, smart homes, smart transportation, and industrial IoT. The company manufactures 12-inch monocrystalline silicon polished and epitaxial wafers, which are essential for semiconductor production. Eswin is dedicated to optimizing advanced equipment and processes to produce high-quality, dislocation-free, ultra-flat silicon wafers, primarily utilized for logic chips, flash memory chips, dynamic random access memory (DRAM), image sensors, and display driver ICs. Additionally, Eswin offers rear-end IC packaging and testing services. The company operates research and development centers in China, the U.K., and South Korea, along with production facilities located in Xi'an, Chengdu, Hefei, and Suzhou.
TBSTest
Series A in 2020
TBSTest Technology is a developer and manufacturer of automatic test equipment for integrated circuits, specializing in ultra-large-scale integrated circuit testing. Founded in 2017 and headquartered in Beijing, China, with additional offices in Xi’an and Shanghai, as well as Suwon, South Korea, the company provides a comprehensive range of products, including test boards, software solutions, and memory systems. TBSTest Technology also offers pre-sales and after-sales support for its equipment, accessories, and software systems, along with application development projects. The company serves a diverse clientele, including clients engaged in integrated circuit design and production, as well as scientific research institutions and educational establishments.
Black Sesame Technologies
Series B in 2019
Black Sesame Technologies is an AI digital imaging technology firm founded in 2016, with locations in Silicon Valley and Shanghai. The company specializes in developing solutions for real-world AI challenges, focusing on image processing, computing images, and embedded sensing platforms. It provides advanced algorithms for applications in smartphones, autonomous driving, and various consumer electronics. The firm conducts extensive research and development, including core algorithm development, ASIC design, and software systems for advanced driver-assistance systems (ADAS). Black Sesame Technologies is committed to innovation, quality, and reliable service, leveraging the extensive industry experience of its team members. The company has designed automotive-grade system-on-chips (SoCs), including the high-computing Huashan Series and the cross-domain Wudang Series, aimed at enhancing intelligent vehicle solutions and driving the future of mobility.
VeriSilicon
Venture Round in 2014
VeriSilicon, headquartered in Santa Clara, California, with an additional office in Plano, Texas, is a semiconductor company specializing in custom silicon solutions and system-on-chip (SoC) turnkey services. It offers a wide range of services, including the design and manufacture of memory chips, and provides licensable digital signal processing cores, Hantro Video IPs, and eDRAM. VeriSilicon caters to diverse industries such as smartphones, media tablets, HDTVs, set-top boxes, and data centers, targeting advanced process technologies like 28nm and FD-SOI. The company's portfolio includes five types of in-house processor IPs and over 1,400 analog and mixed signal IPs and RF IPs, enabling it to deliver comprehensive, customized silicon solutions.
Norel System
Series A in 2013
Norel Systems Ltd. is a fabless semiconductor company headquartered in Tianjin, China, with additional sales and support offices in Shenzhen. Founded in 2009 by experienced professionals from Silicon Valley and local marketing experts, the company specializes in the design and development of complex System-on-Chip (SOC) solutions that require high-speed mixed signal expertise. Norel Systems offers advanced mobile storage solutions, including low power USB 3.0 to SATA bridge controllers, and has developed proprietary PHY IPs for various protocols such as PCIe, HDMI, and Thunderbolt. The company also focuses on Advanced Video Transport (AVT) technology, which provides scalable, real-time, visually lossless solutions for the HD video surveillance market. With a commitment to delivering high-quality products and experiences, Norel Systems aims to lead the market in providing integrated circuit solutions for mobile devices, consumer electronics, and PCs.
Norel System
Venture Round in 2011
Norel Systems Ltd. is a fabless semiconductor company headquartered in Tianjin, China, with additional sales and support offices in Shenzhen. Founded in 2009 by experienced professionals from Silicon Valley and local marketing experts, the company specializes in the design and development of complex System-on-Chip (SOC) solutions that require high-speed mixed signal expertise. Norel Systems offers advanced mobile storage solutions, including low power USB 3.0 to SATA bridge controllers, and has developed proprietary PHY IPs for various protocols such as PCIe, HDMI, and Thunderbolt. The company also focuses on Advanced Video Transport (AVT) technology, which provides scalable, real-time, visually lossless solutions for the HD video surveillance market. With a commitment to delivering high-quality products and experiences, Norel Systems aims to lead the market in providing integrated circuit solutions for mobile devices, consumer electronics, and PCs.
Parade Technologies
Series B in 2007
Parade Technologies, Ltd. is a fabless semiconductor company that specializes in designing, developing, and selling high-speed interface and display processing integrated circuit (IC) chips. Founded in 2005 and headquartered in George Town, Cayman Islands, Parade offers a range of products, including display port LCD timing controllers, format converters, transmitters, receivers, and touch controllers. The company focuses on high-speed video interfacing solutions that cater to applications in personal computers, consumer electronics, and display panels, such as digital TVs and set-top boxes. Parade Technologies operates internationally, with branch offices in Hong Kong and Taiwan, and a design center in Shanghai, China, to support its global customer base. It actively participates in industry standards organizations, contributing to the development of key technologies like the DisplayPort digital video interface standard.
UNISOC
Series C in 2004
UNISOC is a fabless semiconductor company specializing in the research and development of core chipsets for mobile communications and the Internet of Things (IoT). The company produces a wide range of products, including mobile chipset platforms that support various communication standards such as 2G, 3G, and 4G, as well as RF chipsets, wireless connection chipsets, security chipsets, TV chipsets, and image sensor chipsets. With a global workforce of over 4,500 employees and numerous research and development centers, UNISOC ranks among the top three suppliers of mobile baseband chipsets worldwide and is the largest pan-chip supplier in China. The company's offerings enable access to advanced technologies, including 5G and artificial intelligence, for consumer and industrial electronics.
Berkäna Wireless
Series B in 2002
Berkana Wireless is a technology company based in Campbell, California, that specializes in manufacturing components for the mobile phone industry. Founded in February 2001, the company offers a diverse product portfolio that includes processors, Bluetooth products, cellular modems, and Wi-Fi products. Berkana Wireless is particularly noted for its development of complementary metal oxide semiconductor (CMOS) radio frequency integrated circuits (RFICs), utilizing proprietary RF CMOS techniques to create integrated RF and mixed-signal integrated circuits for various wireless applications.
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