Yusi Microelectronics
Seed Round in 2025
Yusi Microelectronics is a company that specializes in the design and development of integrated circuits and semiconductor solutions.
Jingyao Xinhui Semiconductor
Seed Round in 2025
Jingyao Xinhui Semiconductor is the indium phosphide optical chip manufacturer company.
Huixi Intelligent
Series A in 2025
Huixi Intelligent develops autonomous driving technology, focusing on autonomous driving chips and full-scale computing platforms, and provides chip computing platforms, AI software development tools, integrated circuit design and services, and development tool chains to enable enterprises building autonomous vehicles to leverage high-power computing capabilities.
AFilm Semiconductor
Seed Round in 2024
Shouxin Semiconductor is a company that provides high-end equipment manufacturer dedicated to the development of thin film deposition technology.
Erui Micro Semiconductor
Seed Round in 2024
Erui Micro Semiconductor is a semiconductor company that specializes in the development of semiconductor overlay front-end measurement equipment.
ASP Optoelectronics
Series A in 2024
ASP Optoelectronics is focusing on technological advancements and the layout of Micro LED production lines.
Xincheng Semiconductor
Series A in 2024
Xincheng Semiconductor manufactures integrated circuit packaging substrates. Semiconductor is a provider of integrated circuit packaging substrate solutions. It focuses on the research and development and mass manufacture of high-density flip-chip packaging substrates, filling a gap in domestic high-end substrates and assisting the domestic semiconductor industry chain in becoming autonomous and controllable.
Erui Micro Semiconductor
Seed Round in 2024
Erui Micro Semiconductor is a semiconductor company that specializes in the development of semiconductor overlay front-end measurement equipment.
Join Silicon
Series B in 2024
JoinSilicon specializes in providing customized solutions for the semiconductor industry, focusing on chip custom design, system and embedded software design and verification, and integrated circuit package design. The company offers a comprehensive range of services, including simulation and testing, chip design services, and one-stop ASIC design solutions. By transforming application software into transistor-level layouts, JoinSilicon supports clients across various sectors, such as server and computing, automotive, Internet of Things (IoT), and networking. Their extensive experience in co-developing hardware and software enables clients to effectively translate their innovative ideas into tangible products.
Wiseetec is a company that specializes in semiconductor equipment research and development, manufacturing, and sales. The company has specialized in bonding and debonding equipment research and development. The product application encompasses the entire semiconductor field. It provides overall temporary bonding and permanent bonding solutions.
Gazer Technology
Series A in 2023
Gazer Technology is a developer of semiconductor equipment and advanced sensor and control technology, specializing in industrial automation. The company focuses on research and development to innovate comprehensive sensing solutions that enhance production processes across various industries, including lithium-ion battery production, new energy manufacturing, consumer electronics, and healthcare. Gazer's products are designed with unique features that prioritize quality control, safety, and service, enabling businesses to optimize efficiency and improve operational performance.
Kangxinwei
Series A in 2023
Kangxinwei is a developer of storage technology and chips. Their main business includes program output, chip design, and semiconductor device distribution. Their eMMC products use low-power technology and low-power port physical layers to improve the lowest-power PCIe memory module solution, enabling clients to improve device storage capacity.
Xincheng Semiconductor
Series A in 2023
Xincheng Semiconductor manufactures integrated circuit packaging substrates. Semiconductor is a provider of integrated circuit packaging substrate solutions. It focuses on the research and development and mass manufacture of high-density flip-chip packaging substrates, filling a gap in domestic high-end substrates and assisting the domestic semiconductor industry chain in becoming autonomous and controllable.
ASP Optoelectronics
Series A in 2023
ASP Optoelectronics is focusing on technological advancements and the layout of Micro LED production lines.
Abbott Robot
Angel Round in 2023
Abbot Robotics is an industrial robot system integration developer, focusing on the research and development and design of AGV intelligent logistics central control system for smart factories in the field of energy and semiconductors.
Join Silicon
Series A in 2023
JoinSilicon specializes in providing customized solutions for the semiconductor industry, focusing on chip custom design, system and embedded software design and verification, and integrated circuit package design. The company offers a comprehensive range of services, including simulation and testing, chip design services, and one-stop ASIC design solutions. By transforming application software into transistor-level layouts, JoinSilicon supports clients across various sectors, such as server and computing, automotive, Internet of Things (IoT), and networking. Their extensive experience in co-developing hardware and software enables clients to effectively translate their innovative ideas into tangible products.
Zhiyi Juxin Microelectronics Technology
Seed Round in 2022
Zhiyi Juxin Microelectronics Technology manufactures performance AD/DA micro-converter chips and high-speed analog-to-digital converters (ADC) used in radar authentication, communication, navigation, industrial control, and medical instruments.
Qingwei Intelligent Technology
Series B in 2022
Qingwei Intelligent Technologies creates artificial intelligence chips that may be reconfigured to improve energy efficiency. The company's chips are designed with low power consumption, intelligent speech and visual features in mind, providing customers with a better consumer electronics experience and application.
IntEngine
Venture Round in 2021
IntEngine, operating under the name Tanjing Technology, specializes in the development of storage-first architecture, focusing on end-side AI chips and solutions for Internet of Things (IoT) terminal devices. The company is dedicated to enhancing efficiency in daily life through innovative software algorithms and chip hardware technology. IntEngine emphasizes deep learning and machine learning algorithms, providing tailored neural networks and terminal equipment to assist in security upgrades for monitoring systems. By delivering advanced digitalization solutions, IntEngine aims to serve industrial users effectively, facilitating improvements in operational efficiency and security.
Lynxi Technology
Series A in 2021
Lynxi Technology specializes in the design, development, and manufacturing of artificial intelligence-based brain-inspired chips and computing systems. The company produces a range of products, including acceleration cards and AI servers, which are integrated with various drives, toolchains, and system software. Founded in 2018, Lynxi Technology is headquartered in Beijing, China, and aims to advance computing solutions through its innovative technology.
Lynxi Technology
Angel Round in 2018
Lynxi Technology specializes in the design, development, and manufacturing of artificial intelligence-based brain-inspired chips and computing systems. The company produces a range of products, including acceleration cards and AI servers, which are integrated with various drives, toolchains, and system software. Founded in 2018, Lynxi Technology is headquartered in Beijing, China, and aims to advance computing solutions through its innovative technology.