Silicon Catalyst Angels

EnCharge AI is a developer of advanced artificial intelligence hardware and software systems specifically designed for edge computing. The company provides a robust computing platform that enhances AI performance by enabling larger models, improved accuracy, higher resolutions, and support for multiple camera channels. With a focus on scalable AI architectures and flexible software integration, EnCharge AI's technology allows businesses to efficiently access and implement advanced AI capabilities without the need for time-consuming and costly workarounds. The company's innovations are rooted in extensive research and development, positioning it as a leader in the AI hardware and software landscape.

Phosio specializes in producing unique chemicals that facilitate the creation of metal oxide thin films using ultraviolet (UV) light at very low temperatures. These metal oxides are utilized across various industries, including semiconductors, batteries, optical coatings, and optoelectronic devices such as displays and solar cells. Additionally, Phosio develops photoresist materials designed to manufacture high aspect ratio nanostructures, focusing on low-temperature production of high-refractive-index optical coatings that are UV curable, transparent, and robust. These advancements support the tech hardware industry in developing smart devices for components like augmented reality, organic light-emitting diode (OLED), and light-emitting diode (LED) technologies.

RAAAM Memory Technologies Ltd. specializes in innovative on-chip memory solutions designed for the semiconductor industry. The company has developed a high-density memory technology that significantly enhances memory capacity, providing up to 50% greater density compared to traditional options without incurring additional costs, complexity, or performance drawbacks. RAAAM's technology serves as a drop-in replacement for static random access memory (SRAM) in system on chips (SoCs), allowing semiconductor companies to achieve area and power reductions while utilizing standard CMOS manufacturing processes. This advancement enables clients to maximize on-chip memory capacity within a smaller silicon die size, streamlining production and improving efficiency.