STATS ChipPAC

STATS ChipPAC Pte. Ltd. is a prominent provider of semiconductor packaging and testing services, catering to global clients in the communication, consumer, and computing sectors. The company specializes in a range of technologies, including leadframe and laminate packages, fan-out and fan-in wafer level packaging, flip chip interconnect, and system-in-package solutions. Its comprehensive service offerings encompass post wafer fabrication processes, back-end assembly, and testing, along with package design services that assist customers in optimizing packages for complex integrated circuits. STATS ChipPAC operates through a direct sales force across several key markets, including the United States, Singapore, South Korea, China, Taiwan, and Switzerland, generating revenue primarily from wafer probing, bumping, packaging, and testing of semiconductor integrated circuits.