AaltoSemi
Series A in 2023
AaltoSemi is a developer and manufacturer of integrated circuit (IC) substrate products essential for semiconductor packaging. The company offers comprehensive services encompassing research and development, design, production, and testing of substrates, including BT and ABF types. AaltoSemi's product lineup features Coreless, ETS, FCCSP, FCBGA (BT), and FCBGA (ABF) substrates, which are crucial for facilitating communication between chips and circuit boards. As the demand for advanced semiconductor solutions grows, particularly in the automotive electronics sector, AaltoSemi focuses on achieving high precision, quality, reliability, and scalability in its substrate production. The company's offerings support the development of a variety of high-performance devices, including CPUs, GPUs, FPGAs, network ASICs, and 5G mobile phones, thereby addressing the evolving challenges posed by Moore's Law and the expanding market needs.
EVAS Intelligence
Seed Round in 2022
EVAS Intelligence is an autonomous driving chip startup. The company was founded by Liu Hui.
EVAS Intelligence
Seed Round in 2022
EVAS Intelligence is an autonomous driving chip startup. The company was founded by Liu Hui.
Network Intelligence
Series A in 2021
NETINT Technologies is a developer of intelligent silicon solutions for data-intensive applications. The Codensity portfolio enables enterprise, cloud data centers and content providers to deploy high performance applications that they can scale without limit, while minimizing their data storage and processing costs. Our core technology is the Codensity G4 SSD Controller System on Chip (SoC), which provides the intelligence inside our Codensity D400 PCIe NVMe SSDs, and Codensity T400 Video Transcoders. NETINT, founded by an experienced team of storage SoC veterans, is a Canadian venture-funded startup with R&D facilities in Vancouver and Toronto.
NeuronBasic
Series C in 2021
NeuronBasic specializes in the design and development of edge artificial intelligence (AI) chips.
Nuolei Keji
Series C in 2021
Nuolei Keji is an edge artificial intelligence chip developer.
Phlexing
Venture Round in 2021
Phlexing is a company dedicated to the research and development of integrated circuit chips, providing electronic design automation (EDA) toolchain solutions tailored for IC design firms. The company specializes in chip physical design signoff and verification, assisting clients in enhancing the quality of their products through expertise in areas such as parasitic extraction, power integrity, electromigration, IR drop, reliability, and multi-physics domains. By focusing on power consumption, performance, and area (PPA) optimization, Phlexing promotes collaboration and innovation within the chip design and manufacturing sectors, ultimately increasing design efficiency for its customers.
Picocom is a specialist in 5G open RAN baseband semiconductors and software, focused on designing and marketing products that comply with Open RAN standards. The company develops baseband system-on-chips (SoCs) and carrier-grade software tailored specifically for 5G small cell infrastructure. By providing advanced semiconductor solutions, Picocom aims to enhance the capabilities and performance of 5G networks for industry users.
PetaIO Inc., established in 2016 and based in Santa Clara, California, specializes in developing low-power enterprise-level SSD main control chip solutions. The company's core offerings include master drive control chips and comprehensive firmware design services, supporting the latest interface technologies for efficient data center storage applications.
XINYI Information Technology
Series A in 2020
XINYI Information Technology Ltd., established in 2017 with headquarters in Shanghai, China, specializes in designing, developing, and selling system integration and IoT communication chips for the radio frequency simulation industry. Its flagship product is the XY1100 CMOS chip. The company also offers technical consulting services and electronic product development. XINYI operates R&D centers in Shanghai, Nanjing, Chengdu, and Singapore, along with sales offices across China and a supply chain center in Hong Kong. Led by alumni of renowned communication chip companies like Broadcom and Qualcomm, XINYI boasts comprehensive international chip R&D capabilities.
Silicon Integrated
Series B in 2020
Wuhan Silicon Integrated Co., Ltd. is a high-tech company founded in 2016 and headquartered in Wuhan, China, specializing in the design and manufacture of analog mixed-signal integrated circuits. The company focuses on developing high-performance chips for critical applications, notably in 3D optics and intelligent audio. Its product range includes a recognized intelligent audio power amplifier, notable for its differentiated features and excellent cost performance, which is endorsed by leading mobile phone manufacturers. Additionally, Silicon Integrated is well-known for its Time-of-Flight (ToF) sensors, which leverage advanced back-illuminated technology to deliver high precision, small pixel size, and low power consumption. These integrated circuits are utilized in various applications such as augmented reality, virtual reality, machine vision, facial recognition, and autonomous driving, providing manufacturers with the capabilities to enhance their product offerings.
FineMEMS Inc. is a high-tech enterprise based in Shanghai, China, founded in 2011 by a team of experts specializing in integrated circuits and micro-electro-mechanical systems. The company develops a range of testing instruments, integrated circuits, and MEMS sensor modules, focusing on various applications in automotive, industrial, medical, and consumer electronics. Its product offerings include pressure transducers, current sensors, and OEM sensors, catering to the growing demand for advanced electronic solutions. FineMEMS has successfully supplied MEMS pressure sensors and tire pressure monitoring systems to prominent automotive manufacturers in China. Additionally, the company is leveraging its innovative low-cost ASIC and plastic packaging technologies to expand its presence in the medical and consumer electronics sectors, providing first-class technologies and services through its ODM and OEM capabilities.
Cambricon Technologies
Series B in 2018
Cambricon Technologies is a leading innovator in the development of artificial intelligence core chips, focusing on applications in cloud servers, edge computing, and various terminal devices. Founded by Professor Chen Tianshi, a distinguished scientist in processor architecture and artificial intelligence, the company has established itself as a pioneer in smart chip technology. Cambricon is recognized for its groundbreaking products, including the Cambrian-1A processor, which was the first commercial deep learning processor designed for a range of terminal equipment such as smartphones, wearable devices, and autonomous vehicles. With two main product lines—terminal and server—Cambricon provides customers with a diverse array of chip products and system software solutions, positioning itself at the forefront of the AI chip industry.