Dignari Capital Partners

Dignari Capital Partners (HK) Limited is a Hong Kong-based investment management firm founded in 2013, specializing in principal investments across various sectors, including chemicals, oil and gas, retail, utilities, food and beverage, transportation, and professional services. The firm focuses on investment opportunities in China and is licensed by the Hong Kong Securities and Futures Commission. With a team of seasoned professionals who have extensive experience in the region since 2003, Dignari Capital has developed significant local knowledge and a robust network. The firm has successfully navigated challenging market conditions, including the 2008 financial crisis, establishing a solid reputation as a reliable partner in the Asia-Pacific investment landscape.

Chris Chan

Co-Founding Partner and Deputy Chief Investment Officer

Bruce He

Partner, Investments

Qianwei Li

Managing Director, Investments

Juliet Siette

Managing Director and Head of Australia and New Zealand

Grace Tan

Founding Partner and Chief Investment Officer

Rui Tang

Co-Founding Partner, CTO and Head of Business Relations

1 past transactions

MFS Technology

Acquisition in 2018
MFS Technology (S) Pte Ltd, established in 1988 and based in Singapore, specializes in the manufacture and marketing of flexible printed circuits and associated assembly services. The company produces a variety of products, including single-sided and double-sided flexible printed circuits, multilayer flex circuits, bare backed flex circuits, rigid flex circuits, and rigid printed circuit boards. MFS Technology serves a diverse range of industries, including data storage, medical, automotive, industrial, telecommunications, and display modules. The company is known for its capacity to provide turnkey component assembly and module-level integration services, enabling clients to receive cost-effective solutions within a specified timeframe. MFS Technology caters to customers globally, leveraging its expertise to meet the demands of various electronic component applications.
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