F&G Venture

Established in September 2012 by the former rotating CEO of Huawei and partner of Fidelity Asia, F&G Venture is a venture capital fund focusing on companies with exponential growth in IT industries, like IT infrastructure, cloud computing, internet of things, SaaS, big data, microchip, and semi-conductor etc. F&G Venture also targets high-end manufacturing businesses, including modules, intelligence devices and equipment, robots, and drones.

Steve Hong

Managing Partner and Co-Founder

Yu Qian

Co-Founder and Managing Partner

Past deals in Semiconductor

Minxin Technology

Series B in 2024
Minxin Technology focuses on the research, development, manufacture, and sales of photo- and thermal-curing functional materials and electronic-grade wet chemicals.

Abscience Optoelectronic Technology

Series A in 2023
Abscience Optoelectronic Technology is an innovative technology firm that focuses on the development of infrared optoelectronics technology for semiconductors.

TaiXin Semiconductor

Series B in 2022
TaiXin Semiconductor is a high-tech enterprise specializing in chip design, particularly within the AIoT (Artificial Intelligence of Things) sector. The company develops a range of semiconductor chips and power solutions, including Internet of Things (IoT) communication chips, high-definition video codec chips, and power electronics field programmable chips. These products are designed for application in various industries such as transportation, energy, and communication, positioning TaiXin as a key player in the evolving semiconductor market.

Thinktech

Venture Round in 2022
Thinktech is a design and manufacturing company that specializes in producing automotive-grade semiconductors. They provide automotive security designed for ICV applications with built-in hardware. The company focuses on providing comprehensive security solutions to the Chinese automotive sector.

Hangshun Chips

Series D in 2021
Hangshun Chip is a Shenzhen-based manufacturer founded in 2013, specializing in the development of automotive system-on-chip (SoC) solutions and high-end microcontrollers (MCUs). The company employs a dual strategy to enhance the Internet of Everything, focusing on creating smarter technologies for various applications. Its products serve multiple industries, including automotive, medical, industrial, consumer electronics, and smart home technologies. In addition to its headquarters, Hangshun Chip has established branches and offices in Chengdu and Shanghai to support its operations and expand its market reach.

Xinersemi

Series B in 2018
Shenzhen Xiner Semiconductor Technology Co., Ltd. (Xiner) Founded in 2013, they aer jointly invested by Shenzhen Zhengxuan Technology, Shenzhen State-owned Assets Supervision and Administration Commission, Shenzhen Talent Innovation Fund, Dachen Venture Capital, Fangguang Capital, Xiamen Falcon and other well-known institutions. Committed to the development, application and sales of IGBT chips, IGBT driver chips and high-power intelligent power modules. Xiner has an experienced and pragmatic team. The main personnel have accumulated more than ten years of industry and are the first in China to successfully mass produce IGBT products based on FST technology. Xiner has R&D centers in Shanghai and Shenzhen, and has established sales offices in Shenzhen, Shanghai, Qingdao, Shunde and Hangzhou to respond quickly to customer needs. Xiner adheres to the business philosophy of application orientation, research and development, and open cooperation. It deeply explores customer application requirements, focuses on R&D and design of IGBT related products, and cooperates with the best partners in the industry to provide customers with the most stable and cost-effective power devices. They insist on customer-centered, and hope to further cooperate with domestic system application companies to break the foreign monopoly and form the real combat power of domestic system manufacturers!

Minxin Technology

Minxin Technology focuses on the research, development, manufacture, and sales of photo- and thermal-curing functional materials and electronic-grade wet chemicals.
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