Semiconductor Manufacturing International
Semiconductor Manufacturing International Corporation (SMIC) is a semiconductor foundry providing integrated circuit (IC) foundry and technology services at 0.35-micron to 40-nanometer. SMIC develops one-stop turnkey services to meet its customers’ needs. In addition to IC manufacturing, SMIC offers a full range of services that includes design services, mask manufacturing, and testing. SMIC provides integrated circuit (IC) foundry and technology services on process nodes from 0.35 micron to 28 nanometer. Headquartered in Shanghai, China, SMIC has an international manufacturing and service base. In China, SMIC has a 300mm wafer fabrication facility (fab) and a 200mm mega-fab in Shanghai; a 300mm mega-fab and a majority-owned 300mm fab for advanced nodes in Beijing; 200mm fabs in Tianjin and Shenzhen; and a majority-owned joint-venture 300mm bumping facility in Jiangyin; additionally, in Italy SMIC has a majority-owned 200mm fab. Headquartered in Shanghai, China, SMIC has a 300mm wafer fabrication facility (fab) and a 200mm mega-fab in Shanghai, a 300mm mega-fab in Beijing, a 200mm fab in Tianjin, and a 200mm fab project under development in Shenzhen. SMIC also has customer service and marketing offices in the U.S., Europe, Japan, and Taiwan, and a representative office in Hong Kong. SMIC competes with Taiwan Semiconductor Manufacturing Company, Ltd., United Microelectronics Corporation, GlobalFoundries, Fujitsu Limited, Samsung Electronics Co., Ltd., and Toshiba Corporation.
Sheng Microelectronics is a driver chip design company. They engaged in creation of driver chips for amoled display screens, with an emphasis on consumer electronics goods such as smartphones and smart wearables.
OmniSensing Photonics Technology is committed to developing high-end LiDAR technology based on photonics integrated circuits (PIC) and coherent communication to subvert traditional industrial 3D technologies
Xinwang Microelectronics is a high-tech enterprise focusing on the research and development of highly reliable and high-quality 8-bit MCU and 32-bit MCU&DSP based on the independent IP KungFu core architecture. So far, it has successfully delivered KF8F, KF8L, KF8A, KF8TS, KF8S, KF32A, KF32F, KF32L, KF32LS and other products to the professional chip application market, as well as ChipON IDE integrated development environment, ChipON PRO programming software, KungFu Minipro simulation programmer, and real realization From chip core design to tool development, the entire ecological chain has its own IP.
X-EPIC offers a solution that aims to revolutionize EDA technology with a focus on intelligence and innovation. X-EPIC's key technological pillars include Intelligent Debug, Intelligent Compiler, Intelligent Cockpit, and Intelligent Cloud Native. Additionally, their solution encompasses seven verification aspects, including hardware emulation system, FPGA-based prototyping, smart scenario stimulus, formal verification, logic simulation, System debugging, and Verification Cloud, offering clients a comprehensive verification solution. X-EPIC also provides professional verification consulting services to support the effective implementation of its solution.
BYD Semiconductor operates as an electronic components manufacturing company. BYD Semiconductor produces and sells battery management chips, power field effect transistors, image sensors, touch control chips, protection diode, current sensors, and other products.
Biren Technology is a high-tech startup that has the niche in softwares, hardwares, and chip system. The niche software department is led by the industry's top talents, composed of field technical experts and software elite engineers. The niche hardware department is committed to building a wide range of computing solutions based on general computing, combining versatility and specificity. As a frontier research department of the niches, the Institute aims to study the key technologies of new intelligent computing systems, focusing on new architectures and advanced compilation technologies.
LFoundry is focused on providing access to most advanced analogue manufacturing service with a capacity of >40,000 wafers/month, innovative technology extensions, including volume 90nm and copper manufacturing, a strong emphasis on flexibility and customer partnership. LFoundry is supporting own technology IP for 150nm and 110nm with a large portfolio of process-proven libraries, IP, design tools and reference flows. LFoundry is the customer-specific manufacturer of choice for analog, mixed-signal and specialized technologies worldwide, offering world-class process technology, unparalleled flexibility and speed, and IP protection.
SJ Semi is a MEOL foundry focused on front-end wafer manufacturing and quality systems. The company specializes in bumping, Cu pillar, RDL, and testing services for 12" wafers while investing in R&D for fan-out, TSV, interposer, and 3D technologies. With over a decade of experience, SJ Semi aims to support advancements in the semiconductor market.
Brite Semiconductor was founded in 2008 in Shanghaiâ€:tm:s Zhangjiang Hi-tech park, and is a fast growing SoC and ASIC Design Company aimed at assembling the most optimum IP, foundry, test and packaging technologies to create custom silicon solutions for its customers. Brite is committed to delivering electronics solutions with leading edge North American technology, competitive pricing, uncompromising quality and a customer-centric approach to meet all of a customerâ€:tm:s ASIC needs. Brite utilizes the Open Model™ to provide flexible, direct, and cost effective designs that reduce a chipâ€:tm:s time to market. Focused on the customerâ€:tm:s needs, Briteâ€:tm:s comprehensive customer support supplements turnkey spec-parts solutions, third party manufacturing service, product OEM solutions, and all other design service solutions. Briteâ€:tm:s unique MAX technology lowers costs and maximizes yields for advanced 40/45 nm designs. With a proven track record of first time silicon success and the experience of over 200 tapeouts, Brite ensures minimum risk in both frontend and backend physical design, as well as test engineering, packaging and assembly, wafer fabrication, and production support to be our customersâ€:tm: ideal all inclusive ASIC partner.
Brite Semiconductor was founded in 2008 in Shanghaiâ€:tm:s Zhangjiang Hi-tech park, and is a fast growing SoC and ASIC Design Company aimed at assembling the most optimum IP, foundry, test and packaging technologies to create custom silicon solutions for its customers. Brite is committed to delivering electronics solutions with leading edge North American technology, competitive pricing, uncompromising quality and a customer-centric approach to meet all of a customerâ€:tm:s ASIC needs. Brite utilizes the Open Model™ to provide flexible, direct, and cost effective designs that reduce a chipâ€:tm:s time to market. Focused on the customerâ€:tm:s needs, Briteâ€:tm:s comprehensive customer support supplements turnkey spec-parts solutions, third party manufacturing service, product OEM solutions, and all other design service solutions. Briteâ€:tm:s unique MAX technology lowers costs and maximizes yields for advanced 40/45 nm designs. With a proven track record of first time silicon success and the experience of over 200 tapeouts, Brite ensures minimum risk in both frontend and backend physical design, as well as test engineering, packaging and assembly, wafer fabrication, and production support to be our customersâ€:tm: ideal all inclusive ASIC partner.
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