Amkor Technology is a prominent provider of outsourced semiconductor packaging and testing services, catering to integrated device manufacturers, fabless semiconductor companies, and contract foundries. Headquartered in Tempe, Arizona, the company offers a comprehensive range of turnkey services, including semiconductor wafer bumps, back-grinds, package design, and testing. Amkor's product offerings span various technologies, such as wirebond, flip chip, and copper clip interconnects. Notable products include flip chip scale packages for mobile devices, wafer-level chip scale packages for diverse applications, and advanced system-in-package modules utilized in electronics like fingerprint sensors and solid-state drives. The company is recognized for its advanced products, which generate the majority of its revenue, while also providing mainstream solutions such as wirebond packaging. With a global presence, Amkor primarily serves customers in international markets, reinforcing its position as a leader in the semiconductor assembly and test sector.
NANIUM, S.A. is a Portugal-based company specializing in semiconductor assembly, packaging, testing, engineering, and manufacturing services. Founded in 1996 and originally established as Siemens Semiconductors, the company has evolved into a leader in 300mm Wafer-Level Packaging, offering both Fan-In and Fan-Out solutions. NANIUM provides comprehensive in-house capabilities throughout the development chain, including design, prototyping, and advanced packaging technologies. Their services encompass wafer-level chip scale packaging, system-in-package solutions, and various testing methodologies such as wafer probing and characterization. The company focuses on delivering customized solutions that meet demanding customer requirements while ensuring miniaturization and optimal electrical performance. NANIUM operates from its headquarters in Vila do Conde, Portugal, with additional offices in Dresden, Germany, and Boston, USA. As of 2017, it functions as a subsidiary of Amkor Technology, Inc.
J-Devices Corp
Acquisition in 2016
J-Devices Corporation is a semiconductor back-end manufacturing services company headquartered in Usuki, Japan. Founded in 1970 and formerly known as Nakaya Microdevices Corporation, the company specializes in wafer probing, package assembly, final testing, and package development services. It provides a range of packaging solutions, including analysis and simulation technologies, and offers wafer test and final test equipment for devices such as microcontrollers, multimedia products, mobile communications, and sensors. Additionally, J-Devices Corporation produces panel level packaging products tailored for automotive, mobile, analog/RF module, and memory applications. The company operates as a subsidiary of Amkor Technology, Inc.
Unitive
Acquisition in 2004
Unitive is a prominent provider of wafer-level packaging solutions for the semiconductor industry, focusing on making semiconductors smaller, faster, and lighter. The company collaborates with clients to address their product and manufacturing needs through innovative technologies that enhance time-to-market and reduce costs. Unitive's services encompass multi-level passivation, thin film wiring, solder bumping, and chip scale packaging. Additionally, the company specializes in electroplated wafer bumping technologies that facilitate the production of lead-free wafers. Unitive is supported by strategic investors from both financial and industrial sectors, including notable names in the technology space.
Unitive Semiconductor Taiwan
Acquisition in 2004
Unitive Semiconductor Taiwan Corporation provides wafer level technologies and services for flip chip and wafer level packaging applications. It primarily focuses on providing the solder bumping and gold bumping services to worldwide IDMs, fabless IC design houses, foundry fabs, and assembly houses.
Amkor Iwate
Acquisition in 2004
Amkor Iwate Company, Inc. offers semiconductor assembly and testing services. The company's products include a variety of packaging solutions such as stacked-die and thin chip scale packages that are used in cell phones and consumer electronics.
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