Amkor Technology

NANIUM, S.A. is a Portugal-based company specializing in semiconductor assembly, packaging, testing, engineering, and manufacturing services. Founded in 1996 and originally established as Siemens Semiconductors, the company has evolved into a leader in 300mm Wafer-Level Packaging, offering both Fan-In and Fan-Out solutions. NANIUM provides comprehensive in-house capabilities throughout the development chain, including design, prototyping, and advanced packaging technologies. Their services encompass wafer-level chip scale packaging, system-in-package solutions, and various testing methodologies such as wafer probing and characterization. The company focuses on delivering customized solutions that meet demanding customer requirements while ensuring miniaturization and optimal electrical performance. NANIUM operates from its headquarters in Vila do Conde, Portugal, with additional offices in Dresden, Germany, and Boston, USA. As of 2017, it functions as a subsidiary of Amkor Technology, Inc.

J-Devices Corporation is a semiconductor back-end manufacturing services company headquartered in Usuki, Japan. Founded in 1970 and formerly known as Nakaya Microdevices Corporation, the company specializes in wafer probing, package assembly, final testing, and package development services. It provides a range of packaging solutions, including analysis and simulation technologies, and offers wafer test and final test equipment for devices such as microcontrollers, multimedia products, mobile communications, and sensors. Additionally, J-Devices Corporation produces panel level packaging products tailored for automotive, mobile, analog/RF module, and memory applications. The company operates as a subsidiary of Amkor Technology, Inc.

Unitive is the leading provider of wafer-level packaging solutions that make semiconductors smaller, faster and lighter. The company partners with its customers to meet their product and global manufacturing needs through innovative deployment of its technologies, resulting in quicker time-to-market and lower costs. Unitive’s services include multi-level passivation and thin film wiring, solder bumping, and chip scale packaging. The company’s strategic investors include leading financial and industry pioneers such as Onex, Celestica, Flextronics, Conexant Systems and Fairchild Semiconductor.

Unitive Semiconductor Taiwan Corporation provides wafer level technologies and services for flip chip and wafer level packaging applications. It primarily focuses on providing the solder bumping and gold bumping services to worldwide IDMs, fabless IC design houses, foundry fabs, and assembly houses.

Amkor Iwate Company, Inc. offers semiconductor assembly and testing services. The company's products include a variety of packaging solutions such as stacked-die and thin chip scale packages that are used in cell phones and consumer electronics.