CAS Star

CAS Star, established in 2013 and headquartered in Xi'an, China, with an additional office in Beijing, operates as a venture capital investment firm specializing in high-tech industry incubation. The company aims to foster a scientific and technological entrepreneurial ecosystem by connecting research institutions, angel funds, incubators, and entrepreneurship training programs. This comprehensive approach provides structured support for technology entrepreneurs, enabling them to innovate and grow. CAS Star focuses its investments in diverse sectors, including optoelectronic chips, artificial intelligence, aerospace, biotechnology, information technology, new materials, new energy, and intelligent manufacturing.

Lei Mi

Founding Partner and Co-CEO

Past deals in Embedded Software

Ouye Semiconductor

Series B in 2024
Ouyeel Semiconductor is a manufacturer of SoC chips. They offer smart car chips and solutions for automakers, enabling customers to reduce costs and time to develop new products and features.

Ouye Semiconductor

Series A in 2023
Ouyeel Semiconductor is a manufacturer of SoC chips. They offer smart car chips and solutions for automakers, enabling customers to reduce costs and time to develop new products and features.

Physim

Series A in 2022
Physim specializes in the development of electronic design system simulation software, electronic design automation software, and multi-physics simulation computer-aided engineering software. The company offers a range of tools, including electromagnetic, electrothermal, stress, magnetic loss, and fluid simulation tools. These products are designed to assist clients in achieving significant technological advancements, particularly in the areas of 3D integration circuits (3DIC) and Chiplet technologies. Physim’s software solutions facilitate comprehensive simulations, enabling engineers and designers to optimize their processes and improve overall performance in electronic design and engineering applications.

KiwiMoore

Seed Round in 2022
Kiwimoore specializes in advanced packaging chiplet technology, offering innovative solutions for the CPU, GPU, AI, and high-performance computing sectors. The company develops an intelligent integrated silicon substrate that enables the connection of both homogeneous and heterogeneous chiplets, allowing for greater flexibility, enhanced performance, and reduced size. This technology facilitates the creation of new system-on-chip architectures, providing significant value to customers, including original equipment manufacturers (OEMs) and fabless companies. By focusing on heterogeneous computing and integration, Kiwimoore aims to streamline the production of high-performance, large-capacity chips, making the process more efficient and cost-effective for its clients.

CIX Technology

Seed Round in 2022
CIX Technology specializes in developing advanced intelligent computing solutions, focusing on high-performance, energy-efficient general-purpose computing chips and CPUs. Utilizing ARM architecture, the company designs its products for a variety of applications, including notebooks, desktops, high-end tablets, and augmented/virtual reality systems. By enhancing processing power, CIX Technology enables enterprises to create more efficient electronics and other technological products, ultimately improving computing speed and performance across various sectors.

SynSense

Series A in 2020
SynSense is a neuromorphic computing company based in Zurich, Switzerland, founded in 2017. The company specializes in developing ultra-low-power vision and biosignal processors, as well as point cloud and always-on auditory processing solutions. These products are designed for artificial intelligence edge computing applications, including autonomous robots, mobile and embedded devices, wearable healthcare systems, security, computing, and IoT applications. SynSense's neuromorphic processors overcome the limitations of traditional von Neumann computers by providing an unprecedented combination of ultra-low power consumption and low-latency performance.

JingFan

Angel Round in 2017
Tianjin Jingfan Technology specializes in the development of compact embedded intelligent hardware designed for body monitoring. The company utilizes advanced technologies, including photoelectric sensing, artificial intelligence, and big data, to create innovative solutions. Jingfan has developed cloud-based pulse wave monitoring technology for wearable devices, producing 4x4mm chipsets that can be integrated into various products such as clothing, watches, and earphones. This integration allows users to access real-time health information by analyzing pulse waves and other physiological signals, enhancing the ability to monitor and manage health conditions effectively.

JingFan

Seed Round in 2016
Tianjin Jingfan Technology specializes in the development of compact embedded intelligent hardware designed for body monitoring. The company utilizes advanced technologies, including photoelectric sensing, artificial intelligence, and big data, to create innovative solutions. Jingfan has developed cloud-based pulse wave monitoring technology for wearable devices, producing 4x4mm chipsets that can be integrated into various products such as clothing, watches, and earphones. This integration allows users to access real-time health information by analyzing pulse waves and other physiological signals, enhancing the ability to monitor and manage health conditions effectively.

Integense

Angel Round in 2015
Integense specializes in the production of industrial, medical, power management, and infrared sensor chips. The company's solution includes thermal printers, custom asics, power solutions, and other services. This is paired with innovative analog and mixed-signal circuit design to create appropriate solutions for high-volume industrial and consumer applications that deliver world-class performance and superior cost structures.
Spot something off? Help us improve by flagging any incorrect or outdated information. Just email us at support@teaserclub.com. Your feedback is most welcome.