Lam Research

Semsysco is a manufacturing company specializing in the design and production of semiconductor equipment. The company focuses on wet process equipment for the semiconductor industry, offering highly engineered solutions for single-wafer, vertical panel, and batch wet chemical processing. These tools are crucial for both front-end and back-end processes in semiconductor fabrication, with a particular emphasis on advanced wafer-level packaging. This enables customers to efficiently scale their processes across various substrate sizes, transitioning from horizontal wafer processes to vertical panel processing as needed.

2Pi is a platform technology for optical metasurfaces that offers a new class of optical components and systems with exceptional performance, ultra-compactness, light-weight, and novel functionality for use in consumer electronics, industrial automation, automotive, and other applications.

Holo, Inc. is a technology company specializing in the design and manufacture of 3D printed parts using advanced additive manufacturing techniques. Founded in 2017 and headquartered in Oakland, California, Holo utilizes a unique polymer binder platform that is compatible with various materials, including copper, ceramics, and composites. Their patented 3D photolithographic process allows for the simultaneous exposure of eight million voxels, enabling the production of complex geometries that are subsequently chemically processed and sintered to create finished parts. Holo's technology is tailored for high-quality digital manufacturing at scale, addressing the needs of performance-driven applications across diverse industries.

InnoStar Semiconductor is a developer and provider of advanced semiconductor storage technology, specializing in resistive random access memory (ReRam) chips. The company focuses on creating high-performance, low-power storage solutions tailored for applications in information security, Internet of Things (IoT), artificial intelligence (AI), and cloud computing. By commercializing its innovative ReRam technology, InnoStar aims to redefine storage capabilities and intelligent computing, enabling businesses to enhance security measures and meet the growing demands for efficient data storage and processing. Through its commitment to technological advancement, InnoStar Semiconductor is poised to set industry benchmarks in the semiconductor sector.

Array Insights is an IT firm focused on developing artificial intelligence-driven solutions aimed at managing patient and caregiver narratives. The company offers a clinical data registry platform that enables the secure sharing of sensitive healthcare data while maintaining ownership and compliance. By employing advanced encryption techniques, Array Insights connects data algorithms to facilitate the analysis and training of AI models without compromising security or privacy. This platform allows hospitals and healthcare providers to effectively control, track, and trace patient information, thereby enhancing research capabilities and accelerating the pace of innovation in the healthcare sector. Founded in 2017 and based in Cambridge, Massachusetts, Array Insights is dedicated to improving data accessibility while safeguarding proprietary and sensitive information.

Mythic Inc. is a technology company specializing in the design and development of silicon chips and artificial intelligence processing units (IPUs). Founded in 2012 and headquartered in Redwood City, California, with an additional office in Austin, Texas, Mythic focuses on integrating AI capabilities into a wide range of devices, including fitness bands, hearing aids, self-driving cars, and robotic drones. The company leverages its unique analog compute-in-memory technology to create products like the M1076 Analog Matrix Processor and MP10304 Quad-AMP PCIe Card, delivering desktop-grade graphics processing in compact formats. With a diverse team of experts in neural networks, device physics, software design, and processor architecture, Mythic is committed to advancing AI solutions that perform reliably in real-world environments, enhancing the functionality of consumer electronics and other applications while maintaining performance and power efficiency.

Omniome, Inc. is a biotechnology company based in San Diego, California, that specializes in developing a proprietary DNA sequencing platform aimed at providing high accuracy in clinical sequencing. Founded in 2013, Omniome utilizes its Sequencing By Binding technology to enhance nucleotide and DNA matching, leveraging the natural matching capabilities of polymerases. This innovative approach allows researchers to achieve accurate and rapid sequencing results while maintaining low costs. The company's ambition is to become a leading name in DNA sequencing, particularly in advancing cancer diagnostics and improving outcomes in clinical settings.

EchoPixel, Inc. is a medical visualization software company that specializes in three-dimensional imaging technology. Established in 2012 and based in California, EchoPixel develops advanced solutions that allow medical professionals to interact with patient-specific organs and tissues in a virtual reality environment. Its flagship product, the True 3D Viewer, provides a real-time, interactive platform for evaluating and dissecting anatomical structures, enhancing the diagnostic process. Additionally, the company offers the True 3D Medical Education Viewer, which aids medical students in understanding three-dimensional anatomy through computer tomography and magnetic resonance images. EchoPixel also focuses on non-invasive diagnostic tools, including a colon cancer screening solution that utilizes computed tomography images to create a detailed 3D model of the colon, allowing healthcare providers to detect polyps and other abnormalities effectively.

Reno Sub-Systems, to our longtime semiconductor friends, colleagues and customers around the world. The founding of Reno has been a very gratifying challenge which has brought together many of the best and brightest minds in the field of Semiconductor Process Equipment Instrumentation. At a time when industry consolidation and the tightening of venture capital poses a serious threat to new business formation, the founders of Reno have demonstrated the incredible power of inventing world-class technologies to enable next generation processes. With three brand new and highly disruptive technologies, we are creating a paradigm shift in the industry. At Reno, we believe there is unlimited potential for new discoveries and innovative thinking. As we move forward into the 450mm era, Reno stands at the summit of semiconductor process control equipment technology, ready to set the standards for product performance, worldwide customer support and customer satisfaction.

Coventor, Inc. is a leading provider of design automation solutions for microelectromechanical systems (MEMS) and semiconductor technologies. Founded in 1994 and headquartered in Cary, North Carolina, the company specializes in virtual fabrication and offers a range of software solutions, including the SEMulator3D platform, which facilitates 3D semiconductor and MEMS process modeling. This platform enables technology development, sharing of 3D models, automated parameter studies, and integration with other modeling tools. Coventor's MEMS solutions, exemplified by the CoventorMP platform, allow for the efficient creation of finite element models used in various applications across automotive, aerospace, industrial, defense, and consumer electronics sectors. The company serves a global clientele, including integrated device manufacturers, fabless design houses, and research organizations, and provides technical support and customized training services. Coventor operates internationally with offices in various countries, reflecting its commitment to addressing the complex challenges in advanced semiconductor and MEMS design automation.

Novellus Systems, Inc. is a company that develops, manufactures, and supports equipment used in the fabrication of integrated circuits, commonly known as chips or semiconductors. Its customers include businesses that manufacture chips for resale or for use in their own products, as well as those offering chip-manufacturing services to third parties. Novellus operates through two main segments: the Semiconductor Group, which focuses on equipment for integrated circuit fabrication, and the Industrial Applications Group, which provides lapping, grinding, polishing, and deburring equipment for various industrial applications aimed at fine-surface optimization.

Straatum is the leading provider of real-time fault detection and classification solutions to the semiconductor sector worldwide. Fault detection and classification is seen as the foundation stone to meeting the advanced process control (APC) requirements long anticipated in the marketplace…"advanced process control is emerging as an essential ingredient of future wafer processing as necessary process performance challenges the limits of wafer processing equipment" Gartner June 2002.

The SEZ Group is the provider of single-wafer wet-clean processing solutions for the semiconductor industry.

Silfex, Inc. is a privately held manufacturer specializing in precision machined components for various industries, including semiconductor, aerospace, and automotive. The company focuses on ultrasonic silicon machining products that cater primarily to the semiconductor equipment and optical markets. Silfex offers a wide range of products and services, which include silicon ingots, assemblies, rings, gas distribution products, sensors, probes, and critical system components. Additionally, the company provides custom manufacturing services along with precision cleaning, bonding, polishing, and impact grinding. Silfex is committed to delivering high-quality solutions tailored to the specific needs of its clients across multiple sectors.

Avicena Tech specializes in manufacturing advanced optical chip interconnects, operating at ultra-low power and ultra-high speeds (petabit per second). Their innovative technology, based on silicon photonics and other high-volume commercial technologies, enables ultra-dense, low-latency, and low-cost connections between chips. This significantly enhances system performance and efficiency, addressing critical inter-chip communication needs, particularly in applications constrained by traditional electrical interconnects.