Semtech

Semtech Corporation is a prominent supplier of analog and mixed-signal semiconductor products, specializing in the design, development, manufacturing, and marketing of various technologies. The company offers proprietary solutions in power management, protection, advanced communications, human interface, test and measurement, as well as wireless and sensing products. Its integrated circuits are utilized across a wide range of applications, including communications, computing, industrial, and commercial sectors. Semtech operates through four main segments: Signal Integrity, Advanced Protection and Sensing, IoT System, and IoT Connected Services, with the Advanced Protection and Sensing segment generating the majority of its revenue. The company primarily earns its revenue from the Asia Pacific region, catering to the growing demands of the Internet of Things (IoT) and connected services.

Mark Lin

Executive Vice President and CFO

Asaf Silberstein

COO, Operations and Executive Vice President

Hong Hou Ph.D

CEO and President

14 past transactions

Microshare

Corporate Round in 2020
Microshare provides turnkey Smart Facilities data solutions at scale that bring safety, wellness, cost savings, and sustainability to clients' vital assets. Our Sensing-as-a-Service model and global reseller network helped our clients get back to business quickly, safely, and cost-efficiently in 2020, all while shedding new light on the true performance and utility of their real estate holdings to prepare them for success in the post-pandemic future. Microshare is a proud member of the LoRa Alliance and a key provider of LoRaWAN solutions for Microsoft Azure.

IC Interconnect

Acquisition in 2018
IC Interconnect® (ICI) is a US based company which provides contract wafer bumping and related services to the electronics industry. IC Interconnect was founded in 1998 with headquarters and manufacturing facilities located in Colorado Springs, Colorado. High quality, superior customer service, quick-turn and low cost are the focus of the company. IC Interconnect is certified to the ISO 9001:2008 standard. ICI provides wafer bumping services to customers world-wide, including: North America, Europe, Asia, Central America, and the South Pacific. It is IC Interconnect’s intention to be the lowest cost, most responsive wafer bumping service provider in the industry. Call our sales staff today to discover what ICI can do for you.

Lineable

Series A in 2018
Lineable Inc. develops and manufactures smart wristbands for the protection of women and children. Its products include Lineable Lady, Lineable Silver, and Lineable Junior. The company was founded in 2014 and is headquartered in Seoul, South Korea.

e-peas

Venture Round in 2017
e-peas is a disruptive semiconductor company that enables the seamless operation of all connected nodes. The company is developing ultra-low-power high performances circuits such as energy harvester interfaces and microcontrollers that help companies make their IoT devices smarter and more energy-efficient by either prolonging battery life or making the devices live forever. e-peas also develops energy harvesting solutions which extend rechargeable batteries' life of portable devices by harvesting energy from solar, thermal, vibration, radiofrequency, and other sources. These solutions help industries to build products that free users and industries from a burden of replacing non-rechargeable batteries The company was founded in 2014 and is headquartered in Mont-saint-guibert, Brabant Wallon, Belgium.

AptoVision Technologies

Acquisition in 2017
AptoVision is a provider of uncompressed, zero-frame latency, Video over IP solutions addressing the exciting Pro AV market. AptoVision provides advanced chipsets for AV signal distribution.

myDevices

Series A in 2017
myDevices develops middleware platforms and application solutions for the Internet of Things that “simplify the connected world.” myDevices customized solutions allow companies that manufacture, sell and support connected devices to efficiently connect products, manage data, and interact with their customers. myDevices is the first platform of its kind to offer a back-end connected device solution for the enterprise and an interconnected front-end solution for the end user. myDevices is headquartered in Los Angeles and is a division of Avanquest, an global software company

Triune Systems

Acquisition in 2015
Triune Systems is a semiconductor company that provides mixed-signal products for power management, energy harvesting and critical function, and high-reliability applications. The company enables its partners to provide energy efficient solutions for its clients. Triune Systems was founded in 2007 by Ross Teggatz. It is headquartered in Richardson, Texas.

Enverv

Acquisition in 2015
EnVerv is a fabless semiconductor company in the United States with Headquarters in San Jose, California and offices in San Diego and China. Their PLC solutions enable high performance communications via Low-Voltage (LV) and Medium-Voltage (MV) power lines with the goal of providing efficient and effective communications means for Advanced Metering Infrastructure (AMI) as well as other power line-based smart control and monitoring applications.

Powervation

Debt Financing in 2014
Powervation provides a new class of Auto-control digital power IC solutions that optimize power-supply performance and efficiencies for manufacturers of electronic systems used in Computing, NetComms, Storage and other applications. In a simple yet revolutionary Plug-and-Power package, our unique technology delivers a reliable, scalable solution that reduces design complexity and cost, and accelerates time-to-market of eco power-smart systems.

Powervation

Series C in 2012
Powervation provides a new class of Auto-control digital power IC solutions that optimize power-supply performance and efficiencies for manufacturers of electronic systems used in Computing, NetComms, Storage and other applications. In a simple yet revolutionary Plug-and-Power package, our unique technology delivers a reliable, scalable solution that reduces design complexity and cost, and accelerates time-to-market of eco power-smart systems.

Cycleo

Acquisition in 2012
Cycleo is a provider of innovative wireless solutions offering long-range machine-to-machine communication to the wireless world. Based upon a disruptive patented technology, Cycleo

Gennum Corporation

Acquisition in 2012
Gennum Corporation (TSX: GND) designs innovative semiconductor solutions and intellectual property (IP) cores to serve the rising global demand for high-speed data transmission products in the broadcast, networking, storage and telecommunications markets. Gennum offers proven optical, analog and mixed-signal solutions with uncompromising signal integrity to support standards such as high-definition (HD) video, Fibre Channel, InfiniBand®, Ethernet, SONET and PCI Express®. The company is headquartered in Burlington, Canada, and has global design, research and development and sales offices in Canada, Mexico, Japan, Germany, United States, Taiwan, India and the United Kingdom. Gennum Fast Facts: * Dr. Franz Fink, President and CEO * Headquartered in Burlington, Ontario Canada * Founded in 1973 * 2010 revenue of $128 M (USD) * Listed on the Toronto Stock Exchange (TSX:GND) * Employs approximately 400 people worldwide Markets: Broadcast Video Our knowledge of high-speed signal transmission technologies enables us to deliver industry-leading HDTV components for professional and broadcast video markets. Our award-winning portfolio includes SDI equalizers, crosspoints, reclockers, cable drivers, serializers, deserializers, timing and clock conditioning solutions. As a key contributor to the SMPTE, we continue to pioneer transport technologies that deliver new experiences for the video broadcast market. Networking, Storage and Telecom The demand for more bandwidth and increased speed to support the explosion of data and video traffic over the internet is driving the need for high-speed signal integrity solutions that ensure ultra-fast data transmission in various networking, storage and telecommunications applications. To ensure the networks of today and tomorrow can meet this growing demand, Gennum leverages its expertise in high-performance, integrated module ICs and components for the high speed (10G+) optical transceiver market to offer a comprehensive suite of backplane interconnect and optical transceiver ICs including laser/modulator drivers, equalizers, SerDes, receive optical sub-assemblies (ROSAs), clock and data recovery (CDRs), re-drivers, bridges, limiting amplifiers and transimpedance amplifiers (TIAs). Our high-speed and high-performance optical transceiver component technology allows for integration and bundling advantages and our expertise positions us well for the nascent 40/100G market. In addition, Gennum’s Snowbush Division delivers high-speed digital and mixed-signal IP for the computer, networking, storage and telecom markets, accelerating product development by providing co-engineering resources and high-performance platform technology. Industrial Connectivity Designers of industrial video applications are rapidly upgrading their existing analog-over-coaxial systems to full bandwidth HD video. Gennum AviiaTM (Advanced Video Interface for Industrial Applications) solutions meet this need with the industry’s first HD video-over-coax interface for industrial imaging applications. Aviia solutions expand Gennum’s leading A/V technology into new markets including video surveillance (HDcctv), machine vision, medical, digital signage, passenger infotainment, industrial imaging and video conferencing. A pioneer in this market, Gennum is a founding member of the HDcctv Alliance, an industry consortium developing HD connectivity standards for mainstream video surveillance and CCTV applications. Consumer Connectivity Today's consumer applications require increasing levels of performance and data throughput. For example, Intel's Thunderbolt™ technology is a revolutionary new high-speed computer input/output (I/O) method that offers a quantum leap in data transfer rates compared to other standards. These unprecedented speed requirements place unique demands on the transmission media. That's where Gennum's expertise in the 10Gb/s datacom space comes into play. Our many years of experience with high-speed links has given us the unique capability to rise to the challenges of Thunderbolt™ with the industry's first high-speed solutions for Thunderbolt™ applications. Intellectual Property (IP) Gennum's Snowbush IP group addresses the need for the design and delivery of silicon-proven, high-speed serial interface IP. The Snowbush IP portfolio includes complete, integrated, PHY and controller solutions for standards such as SuperSpeed USB, PCI Express® and Serial ATA (SATA), and single and multi-standard SerDes for applications with data rates from 1 Gb/s to over 10 Gb/s. Gennum's Snowbush IP group is committed to supporting customers with diverse foundry and process requirements.

Sierra Monolithics

Acquisition in 2009
Provider of RFICs and modules for wireless, wireline, and military applications. The company aims to leverage its mixed signal IC design and specialize in high-frequency aerospace and defense communications. Currently it makes products for Broadband Wireless (WiMAX RFICs), Optical Communication (OC-768 SerDes), and Microwave/Millimeter Wave (C, I, J, Ku, and L band modules) markets.

Xemics

Acquisition in 2005
Xemics is a fabless semiconductor company which develops and delivers ultra low-power, short-range wireless connectivity solutions. They provide highly integrated solutions for applications ranging from headsets to Bluetooth-enabled portable equipment, sensor networks, Internet appliances and GPS platforms. We deliver innovative integrated circuits for your products straight to you via our expanding worldwide sales and distribution network.
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