Wise Road Capital

Newbase is a wireless communication technologies for 4G/5G networks and future 6G technologies, and focuses on the design and development of baseband SoC chips for mobile communication terminals.

Capcon is a developer and manufacturer specializing in semiconductor assembly and packaging equipment. The company provides advanced products and innovative solutions tailored for the semiconductor assembly and packaging industry. Its diverse product line includes Flip-Chip Bonders, Chip-on-Wafer Bonders, Package-on-Package Bonders, Stack Die Bonders, Panel-Level Die Bonders, and Multi-Chip Die Bonders. These offerings enable clients to utilize high-precision, high-speed, and high-reliability semiconductor equipment, thereby enhancing productivity in their operations.

Xinsheng Semiconductor is a semiconductor and discrete device manufacturing company. They provide research, development, and sales of acoustic filters and RF front-end module products. They provide products such as filters, duplexers, multiplexers, and modules below 6 GHz. They also provide technical services.

Tsinghua Unigroup designs, manufactures, and markets wireless systems-on-chip and radio-frequency semiconductors for cellular, connectivity, and broadcast applications. Its product portfolio includes radio-frequency front-end modules, power amplifiers, transceivers, set-top box tuners, Bluetooth and FM combo chips, and mobile television receivers. These products are incorporated into various devices such as mobile handsets, set-top boxes, MP3 players, and other wireless consumer electronics.

ePAK International, Inc. specializes in the design, manufacture, and supply of precision-engineered packaging products for the automated transport and handling of semiconductor and electronics devices. The company offers a comprehensive range of products, including wafer handling solutions, integrated circuit shipping and handling trays, disk drive products, and end-system sub-assembly handling products. Additionally, ePAK manufactures various containers and tools, such as wafer canisters, embossed carrier tapes, and shipping boxes. With a focus on serving semiconductor firms, system original equipment manufacturers, and integrated circuit assembly and test operations, ePAK is well-positioned to meet market demands. Founded in 1999 and headquartered in Austin, Texas, the company utilizes a centrally located manufacturing facility and maintains global sales centers to effectively cater to its customer base.

Founded in 1945, Huba Control specializes in the development, manufacturing, and marketing of components for pressure and flow measurement. Its product portfolio includes pressure transmitters, switches, sensors, cells, digital indicating devices, and accessories. The company serves clients globally from its headquarters in Switzerland.

Huaqin specializes in the design, development, and production of smartphones, tablets, notebooks, servers, and IoT products. As a global leader in ODM services, Huaqin partners with Google to ensure secure Android devices for customers worldwide.

Huaqin specializes in the design, development, and production of smartphones, tablets, notebooks, servers, and IoT products. As a global leader in ODM services, Huaqin partners with Google to ensure secure Android devices for customers worldwide.

UTAC Group ("UTAC Holdings and subsidiaries") is a leading independent provider of semiconductor assembly and testing services for a broad range of integrated circuits including mixed-signal, analog and memory. The Group offers a full range of package and test development, engineering and manufacturing services and solutions to a worldwide customer base, comprising leading integrated device manufacturers (IDMs), fabless companies and wafer foundries. UTAC Group operates manufacturing facilities in Singapore, Thailand, Taiwan and China in addition to its global sales network.